Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Gigadevice GD25LQ128ESIGR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Gigadevice GD25LQ128ESIGR
- Type
- GIGADEVICE
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- GIGADEVICE
- Electronic Component
- GD25LQ128ESIGR
- Electronic Component
- 1
- Package
- SOP-8-208mil
- Electronic Component
- NOR FLASH
- Electronic Component
- 0.34g
- Electronic Component
- 1
- Electronic Component
- BM0218939913
- Electronic Component
- 128Mbit
- Operating Voltage
- 1.65V~2V
- Current
- 35uA
- Interface Type
- SPI
- Electronic Component
- 100000
- Clock Frequency(fc)
- 120MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD25LQ128ESIGR 产品概述
概述
GD25LQ128ESIGR 是由 GigaDevice Semiconductor (HK) Limited 生产的一款高性能 NOR Flash 存储器，其拥有 128Mb (16M x 8) 的存储容量。该器件采用 SPI（串行外设接口）四个 I/O 通道的通信方式，使其在数据传输速度上表现优异。设计目标是为了满足各种嵌入式系统和消费电子设备的非易失性存储需求。
主要特点
- 存储类别: NOR Flash，具备优秀的随机存取速度和低延迟访问特性，非常适合固件存储、代码执行和数据保存等场合。
- 存储容量: 128Mb，提供足够的空间来存储应用程序、配置数据或用户数据，是许多高端应用的理想选择。
- 接口类型: 采用 SPI 四 I/O 接口，该接口支持双向数据传输，能够有效提高数据传输速率。
- 时钟频率: 工作频率高达 120 MHz，进一步提升了数据传输的效率，缩短了应用程序的启动时间和响应时间。
性能指标
- 访问时间: 该器件的访问时间仅为 7 ns，意味着它能够以极快的速度响应数据请求，非常适合需要快速读取的应用场景。
- 写周期时间: 包括字写和页写，具有 60µs 和 2.4ms 的写入周期时间，适合对数据处理速度要求较高的应用。
- 电源电压: 工作电压范围为 1.65V 至 2V，使得其在低功耗应用中表现突出，尤其适合便携式和移动设备。
工作环境
GD25LQ128ESIGR 的工作温度范围为 -40°C 至 85°C，提供了良好的环境适应能力，使其能够在各种严酷环境下可靠工作，适合汽车电子、工业控制和消费电子等多个领域。
封装与安装
- 封装类型: 该器件采用 8-SOIC 封装，尺寸为 0.209"（5.30mm 宽），具备紧凑的设计，适合各种表面贴装应用。
- 安装方式: 作为表面贴装型元器件，GD25LQ128ESIGR 适用于自动化生产线的高效焊接，有助于降低生产成本，并提高产品的一致性和可靠性。
应用领域
GD25LQ128ESIGR 可广泛应用于：
- 嵌入式系统: 各类微控制器、数字信号处理器和其他嵌入式平台的固件存储。
- 消费电子: 智能手机、平板电脑、智能家居设备等。
- 汽车电子: 汽车控制模块、信息娱乐系统和导航仪等。
- 工业设备: 工业控制器、数据收集器等对数据存储可依赖性的要求较高的自动化设备。
总结
GD25LQ128ESIGR 是一款功能强大、性能优异的 NOR Flash 存储器，凭借其高容量、高速读写以及宽广的工作温度范围，充分满足了现代电子设备对存储器的多样化需求。无论是在设计要求还是在应用场景上，它都展现出了良好的适应性和出色的性能，是行业内值得信赖的存储解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
