WMSIC Electronic Components

Gigadevice GD32F310F4P6TR

ModelGD32F310F4P6TR
PackageTSSOP20
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32F310F4P6TR
Type
GIGADEVICE
Minimum package
3000

Technical parameters

Electronic Component
GIGADEVICE
Electronic Component
GD32F310F4P6TR
Electronic Component
1
Package
TSSOP20
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.8g
CPU
ARM Cortex-M4
I / O
39
Electronic Component
1
ADC
10bit;8bit;6bit;12bit
Electronic Component
BM0264863345
Operating Voltage
2.6V~3.6V
CPU
72MHz
Electronic Component
3000
Electronic Component
16KB
Memory Type
FLASH

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32F310F4P6TR 产品概述

一、产品简介

GD32F310F4P6TR 是北京兆易创新(Gigadevice)推出的一款面向中低功耗、实时控制与传感类应用的32位单片机。该器件基于 ARM Cortex-M4 内核,主频最高可达 72MHz,集成 16KB Flash 程序存储,并提供丰富的通用 I/O 与模拟采集能力,适合便携、工业控制、测量和消费电子等多种场景。

二、主要规格

  • 核心:ARM Cortex-M4
  • 最大主频:72 MHz
  • 程序存储:16 KB FLASH
  • I/O 数量:39 个可用 I/O 引脚
  • ADC 分辨率:支持 6/8/10/12 位等多种分辨率选项
  • 工作电压:2.6 V ~ 3.6 V
  • 封装:TSSOP-20
  • 品牌:Gigadevice(北京兆易创新)

三、功能与特性

  • 实时控制能力:基于 Cortex-M4 内核,在 72MHz 主频下能有效处理控制算法与中等复杂度的信号处理任务,适配PID控制、传感器数据预处理等实时需求。
  • 充足的 I/O 与外设接口:39 个 I/O 引脚满足多路传感器、按键、指示灯和通信总线的接入要求,器件引脚分布适合常见外设布局。
  • 灵活的 ADC 配置:支持从 6 位到 12 位的 ADC 分辨率,可在分辨率与采样速率之间进行权衡,方便在功耗、精度与速度之间取得平衡,适合多种模拟量采集场景。
  • 系统电源与兼容性:2.6V~3.6V 的工作电压范围覆盖典型的 3.3V 供电系统,利于与常见外设和传感器直接接口。
  • 紧凑封装:TSSOP-20 小封装在保证功能的同时占用面积小,适合空间受限的终端设计。

四、典型应用场景

  • 便携测量仪表:多路 ADC 支持和低功耗特性,适合电池供电的手持仪器与数据采集终端。
  • 工业控制终端:用于电机驱动的辅助控制、温控与过程监测等中等复杂度控制任务。
  • 传感器网关与数据前端:作为传感器信号的采集与预处理单元,向上位机或主控模块传输已滤波/校准的数据。
  • 消费电子与家电:按钮控制、指示灯驱动、简单通信协议的实现等。

五、封装与采购建议

GD32F310F4P6TR 采用 TSSOP-20 封装,适合中小批量生产与手工焊接调试。设计时建议预留稳压与去耦电容,合理规划外部晶振与复位电路以保障系统稳定。选型时如需更大 Flash 或更多外设资源,可参考同系列其他封装/型号以满足扩展需求。

总体而言,GD32F310F4P6TR 在体积、功耗与性能之间提供了平衡的选择,适合需要 32 位处理能力与多路模拟采集的嵌入式产品。

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