Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD25LQ80CEIGR 是由北京兆易创新(Gigadevice)公司生产的一款高性能 FLASH-NOR 存储器集成电路(IC)。这款芯片采用先进的闪存技术,提供了高效、可靠的数据存储解决方案,广泛应用于各种电子设备中。
GD25LQ80CEIGR 采用 8-USON(2x3)封装,这是一种紧凑、低-profile 的封装形式,非常适合现代电子产品的空间要求。这种封装方式不仅节省了 PCB 空间,还提高了产品的可靠性和抗振动能力。
GD25LQ80CEIGR 支持四线 SPI 接口,包括 SIO0、SIO1、SIO2 和 SIO3。这允许设备在高达 104 MHz 的时钟频率下进行数据传输,显著提高了数据访问速度和系统整体性能。
该芯片的供电电压范围为 1.65V ~ 2.1V,这使得它非常适合低功耗应用场景。低功耗设计有助于延长电池寿命,减少热量产生,并提高系统的整体效率。
GD25LQ80CEIGR 具有快速的写入速度,字写周期时间仅为 50 µs,页写周期时间为 2.4 ms。这不仅提高了数据写入效率,还确保了数据的可靠性和完整性。
该芯片支持 -40°C ~ 85°C 的宽温工作范围,这使得它可以在各种环境条件下稳定运行,无论是在极寒还是高温条件下,都能保持出色的性能和可靠性。
GD25LQ80CEIGR 广泛应用于嵌入式系统,如工业控制器、医疗设备、汽车电子等领域。其高性能和低功耗特性使其成为这些系统中的理想选择。
在物联网(IoT)设备中,GD25LQ80CEIGR 可以作为数据存储单元,用于存储配置信息、日志数据或其他重要数据。其小尺寸和低功耗特性特别适合于 IoT 设备的需求。
该芯片也可以用于消费电子产品,如智能家居设备、可穿戴设备等。其快速的数据访问速度和高可靠性写入机制确保了这些产品的稳定运行和高效性能。
北京兆易创新公司提供了全面的一套开发工具和技术支持,包括详细的数据手册、评估板、软件开发包(SDK)等。这些资源有助于工程师快速评估和集成 GD25LQ80CEIGR 芯片,缩短产品开发周期。
GD25LQ80CEIGR 是一款功能强大、性能优异的 FLASH-NOR 存储器 IC。其高性能 SPI 接口、低功耗设计、宽温工作范围以及紧凑的封装形式,使其成为各种电子设备中的理想选择。无论是在嵌入式系统、物联网设备还是消费电子产品中,GD25LQ80CEIGR 都能提供可靠、高效的数据存储解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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