WMSIC Electronic Components

Gigadevice GD25Q64ETIGR

ModelGD25Q64ETIGR
PackageSOIC-8
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Gigadevice GD25Q64ETIGR
Type
GIGADEVICE
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD25Q64ETIGR
Electronic Component
1
Package
SOIC-8
Electronic Component
NOR FLASH
Electronic Component
0.523g
Electronic Component
1
Electronic Component
BM0020291870
Electronic Component
64Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
12uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD25Q64ETIGR 产品概述

产品简介

GD25Q64ETIGR 是 GigaDevice Semiconductor (HK) Limited 旗下的一款高性能 NOR Flash 存储器,具有64Mb (8M x 8) 的存储容量。该产品采用了 SPI 四 I/O 接口,能够在高达 133 MHz 的时钟频率下工作。这一特性使其成为嵌入式系统、消费电子以及工业应用领域的理想选择。

存储器技术

作为非易失性存储器,GD25Q64ETIGR 在断电情况下能够安全保留数据。其基于 FLASH - NOR 技术,该技术以其快速的读取速度、随机读取能力和可靠的数据保持特性而广泛应用于各种电子设备。NOR Flash 使得数据访问更加高效,尤其适合要求快速启动和执行代码的嵌入式应用。

存储容量与访问速度

GD25Q64ETIGR 提供高达 64Mb 的存储容量,满足大多数现代电子设备对存储的需求。同时,产品的访问时间仅为 7 ns,这使其能够快速响应数据读写请求,提高整体系统性能。对于页面编程,GD25Q64ETIGR 的写周期时间为 70μs,而整页写入时间为 2.4ms,确保在较复杂的数据传输情景下也能保持良好的性能。

电源和操作环境

GD25Q64ETIGR 在电源供应方面具有广泛的灵活性,工作电压范围为 2.7V 至 3.6V,适配不同的设计需求。该器件的工作温度范围为 -40°C 至 85°C,支持在各种恶劣环境条件下的应用,尤其适用于工业控制和户外设备等领域。

封装与安装

该产品采用 8-SOIC 的封装形式,宽度为 3.90mm,适合表面贴装技术(SMD)。这种表面贴装设计不仅节省了板上空间,还实现了更高的组装密度,使得 GD25Q64ETIGR 可以灵活应用于各类有限空间的设备中。

应用领域

由于其优异的性能指标和广泛的工作特性,GD25Q64ETIGR 被广泛应用于以下领域:

  • 消费电子:如智能手机、平板电脑、智能家居设备等,提供快速的数据存储和访问能力。
  • 工业应用:在工业自动化设备、传感器和控制器中,为数据采集和处理提供稳定的内存支持。
  • 汽车电子:在汽车仪表及信息娱乐系统中,提供可靠的数据存储与访问,确保关键系统的稳定性和安全性。

结语

总之,GD25Q64ETIGR 作为 GigaDevice Semiconductor 推出的一款高性能 NOR Flash 存储器,凭借其紧凑的尺寸、快速的访问速度和广泛的工作电压范围,完全能够满足现代电子设备对存储的高要求。无论是在消费电子还是工业市场,该产品都提供了可靠的解决方案,是设计工程师的重要选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.