WMSIC Electronic Components

Gigadevice GD25Q80CTIGR

ModelGD25Q80CTIGR
PackageSOP-8
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD25Q80CTIGR
Type
GIGADEVICE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD25Q80CTIGR
Electronic Component
1
Package
SOP-8
Electronic Component
NOR FLASH
Electronic Component
0.187g
Electronic Component
1
Electronic Component
BM0222785684
Electronic Component
8Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
1uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
120MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD25Q80CTIGR 产品概述

GD25Q80CTIGR 是由北京兆易创新(Gigadevice)推出的一款高性能FLASH-NOR存储器,旨在满足现代电子设备中对数据存储的多样化需求。作为一款表面贴装型的非易失性存储器,GD25Q80CTIGR 具备多项优秀的技术参数,广泛应用于消费电子、工业控制、通信设备等领域。

主要参数特点

  1. 存储容量与结构: GD25Q80CTIGR 拥有8Mb(1M x 8)的存储容量,适合需要中等存储需求的应用场合。其结构为NOR FLASH,具有更好的随机读性能,适合代码执行和数据存储。

  2. 接口与性能: 此款存储器采用SPI(Serial Peripheral Interface)四I/O接口,允许更高的传输速率和效率。其时钟频率高达120MHz,可以实现更快速的数据读取和写入操作。此外,写周期时间方面,逐字写入可达到50µs,逐页写入时间为2.4ms,大大提升了数据处理效能。

  3. 工作温度与电压范围: GD25Q80CTIGR 的工作温度范围为-40°C到85°C,使其在苛刻环境下也能稳定运行。设备供电电压范围为2.7V到3.6V,适应多种电源需求,给设计提供了灵活性。

  4. 封装形式: 这款产品采用8-SOP封装,方便在现代PCB的表面贴装中应用,降低了设计成本和空间占用。

应用领域

GD25Q80CTIGR 以其优异的性能被广泛应用于多个领域,包括但不限于:

  • 消费电子:如智能手机、平板电脑和数字相机等产品中,通常需要较快的读取和写入速度以支持系统运行和数据处理。
  • 工业控制:在自动化设备、传感器和其他控制应用中,可靠的数据存储和快速的存取能力是确保系统稳定性的关键。
  • 通信设备:如路由器和交换机等网络设备中,GD25Q80CTIGR 的高性能特性可以支持大量数据包的处理。

竞争优势

与其他同类产品相比,GD25Q80CTIGR 具有显著的竞争优势:

  1. 高稳定性与可靠性:其广泛的工作温度范围和优异的性能保证了在极端环境下的可靠性。
  2. 出色的效率:SPI四I/O的使用显著提高了数据传输速率,减少了整体的数据处理时间。
  3. 长期数据存储:作为非易失性存储器,GD25Q80CTIGR 在断电情况下依旧能保持数据的完整性,确保长期可靠存储。

总结

总之,GD25Q80CTIGR 是一款优秀的闪存存储器,具备大容量、快速性能以及宽工作温度范围,适合多种工业和消费电子的应用需求。凭借其卓越的技术参数与多样的应用场合,GD25Q80CTIGR 将为现代电子产品的设计与开发提供强有力的支持。对于寻求高效能存储解决方案的工程师和设计师而言,该产品无疑是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.