Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD25Q80CTIGR 是由北京兆易创新(Gigadevice)推出的一款高性能FLASH-NOR存储器,旨在满足现代电子设备中对数据存储的多样化需求。作为一款表面贴装型的非易失性存储器,GD25Q80CTIGR 具备多项优秀的技术参数,广泛应用于消费电子、工业控制、通信设备等领域。
存储容量与结构: GD25Q80CTIGR 拥有8Mb(1M x 8)的存储容量,适合需要中等存储需求的应用场合。其结构为NOR FLASH,具有更好的随机读性能,适合代码执行和数据存储。
接口与性能: 此款存储器采用SPI(Serial Peripheral Interface)四I/O接口,允许更高的传输速率和效率。其时钟频率高达120MHz,可以实现更快速的数据读取和写入操作。此外,写周期时间方面,逐字写入可达到50µs,逐页写入时间为2.4ms,大大提升了数据处理效能。
工作温度与电压范围: GD25Q80CTIGR 的工作温度范围为-40°C到85°C,使其在苛刻环境下也能稳定运行。设备供电电压范围为2.7V到3.6V,适应多种电源需求,给设计提供了灵活性。
封装形式: 这款产品采用8-SOP封装,方便在现代PCB的表面贴装中应用,降低了设计成本和空间占用。
GD25Q80CTIGR 以其优异的性能被广泛应用于多个领域,包括但不限于:
与其他同类产品相比,GD25Q80CTIGR 具有显著的竞争优势:
总之,GD25Q80CTIGR 是一款优秀的闪存存储器,具备大容量、快速性能以及宽工作温度范围,适合多种工业和消费电子的应用需求。凭借其卓越的技术参数与多样的应用场合,GD25Q80CTIGR 将为现代电子产品的设计与开发提供强有力的支持。对于寻求高效能存储解决方案的工程师和设计师而言,该产品无疑是一个理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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