WMSIC Electronic Components

Gigadevice GD32E103TBU6

ModelGD32E103TBU6
PackageQFN-36
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32E103TBU6
Type
GIGADEVICE
Minimum package
2940 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32E103TBU6
Electronic Component
1
Package
QFN-36
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.75g
CPU
ARM Cortex-M4
I / O
80
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0230024708
Operating Voltage
1.71V~3.6V
CPU
120MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32E103TBU6 产品概述

一、概述

GD32E103TBU6 是北京兆易创新(Gigadevice)推出的一款基于 ARM Cortex‑M4 内核的高性能单片机,面向对计算能力与外设资源有较高要求的嵌入式应用。器件内置 FLASH 程序存储器(128KB),工作电压范围宽(1.71V ~ 3.6V),最高主频可达 120MHz,适合实时控制、信号采集与处理等任务。

二、主要特性

  • CPU 内核:ARM Cortex‑M4,具备良好的整数运算和数字信号处理能力。
  • 主频:最高 120MHz,提供充足的处理性能用于复杂算法与多任务处理。
  • 存储:128KB FLASH(用于程序存储);片内数据与外设支持灵活分配。
  • 模数转换/数模转换:ADC 12 位精度;DAC 12 位精度,适合高精度采样与波形输出应用。
  • 电源:工作电压 1.71V ~ 3.6V,支持多种电源方案与低功耗设计需求。
  • I/O:可提供高达 80 个 I/O(具体受封装和引脚复用影响)。

三、外设与接口

GD32E103TBU6 在外设方面具备丰富的扩展能力,常见接口覆盖通用串口、SPI、I2C、定时器、PWM 输出、ADC/DAC 等(具体通道数与功能请参照器件数据手册)。这些外设使芯片在传感器接口、通信协议实现和电机控制等场景中具备良好适配性。

四、电气与性能说明

器件工作于 1.71V 至 3.6V 电压范围,便于与 1.8V、3.3V 等系统电压兼容;12 位 ADC 与 DAC 提供了中高精度的模拟量处理能力。120MHz 的处理能力结合 Cortex‑M4 的指令集优化,使其在实时控制、滤波与简单 DSP 任务上具有优势。

五、封装与选型

该型号以 QFN‑36 封装提供,适合对体积与散热有要求的嵌入式设计。封装引脚有限,设计时需注意引脚复用与外设分配。订购与选型时请参考完整型号与温度等级,确保与 PCB 封装和焊接工艺匹配。

六、典型应用与设计要点

  • 典型应用:工业控制、仪器仪表、智能家居控制、嵌入式传感器节点、低速电机与伺服控制等。
  • 设计要点:合理分配 GPIO 与外设复用;注意电源去耦与模拟前端布局以保证 ADC/DAC 精度;根据功耗需求使用合适的工作模式与时钟配置。

七、资料与支持

在产品评估与开发阶段,建议参考厂商提供的数据手册、引脚分配表、电路参考设计及评估板资料,以便更快完成硬件与软件验证。若需移植外设驱动或进行性能调优,可结合示例工程进行开发验证。

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