Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD32F130F4P6TR基于ARM Cortex‑M3内核,最高主频72MHz,适合对实时性和控制性能有一定要求但对成本和尺寸敏感的嵌入式应用。72MHz主频在多数控制、通信和信号处理场景下能提供充足的计算能力,同时功耗可控。
器件提供16KB的片上FLASH程序存储,适合中小规模固件。15路可用I/O口可实现多路数字输入输出或复用外设功能,适合按键、指示灯、驱动小型外设以及简单总线接口的实现。设计时应根据实际I/O使用分配复用功能,合理安排GPIO/外设映射,避免引脚冲突。
片内具备12位ADC,满足常见传感器采集与小信号测量需求。工作电压范围2.6V~3.6V,支持典型3.3V系统,便于与常见外设和传感器直接接口。使用ADC时注意采样时间、输入阻抗和参考电压稳定性,必要时在ADC输入处增加采样电容或缓冲放大器以提高测量精度。
采用TSSOP‑20小封装,适用于尺寸受限的产品设计,便于高密度PCB布局与批量生产。TSSOP‑20在手工焊接与SMT生产间具有良好兼容性,适合中小批量的工业与消费类产品。
基于Cortex‑M3,快速上手主流开发工具链(Keil MDK、GCC arm‑none‑eabi、IAR等),并可通过标准SWD接口(SWDIO/SWCLK)使用J‑Link、ST‑Link等调试器进行下载与单步调试。固件设计应考虑16KB Flash的容量限制,采用模块化、精简的库与编译优化以控制代码体积。
适合:工业控制小型单元、传感器信号采集、仪表仪器、家电控制面板、消费类低成本产品、教育与原型开发等需要低成本、低功耗和小封装的场合。
总结:GD32F130F4P6TR以72MHz Cortex‑M3性能、12位ADC、15路I/O和16KB FLASH的组合,在小体积、低成本系统中提供均衡的处理能力与功能,是中小型嵌入式控制与采集项目的优选芯片。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products