WMSIC Electronic Components

Gigadevice GD32E103RBT6

ModelGD32E103RBT6
PackageLQFP-64(10x10)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32E103RBT6
Type
GIGADEVICE
Minimum package
960 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32E103RBT6
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.594g
CPU
ARM Cortex-M4
I / O
51
Electronic Component
1
ADC
12bit
DAC
12bit
Electronic Component
BM0258832486
Operating Voltage
1.71V~3.6V
CPU
120MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32E103RBT6 产品概述

一、产品概况

GD32E103RBT6 是兆易创新(Gigadevice)推出的一款基于 ARM Cortex-M4 内核的高性能 32 位微控制器。内核主频最高可达 120 MHz,片上程序存储为 128 KB Flash,内部 SRAM 为 32 KB(产品描述中有标注),封装为 LQFP-64(10x10 mm),共提供约 51 个可用 I/O。工作电压范围宽,支持 1.71 V 至 3.6 V,内置 12 位 ADC 与 12 位 DAC,适用于中高性能嵌入式控制和数据采集应用。

二、主要性能特点

  • 高性能 CPU:ARM Cortex‑M4 内核,最高 120 MHz,适合需要 DSP 指令集和快速控制的场合。
  • 存储资源:128 KB Flash 提供充足的程序空间,32 KB SRAM 满足运行时数据缓存与堆栈需求。
  • 丰富的模拟能力:片内 12 位 ADC 与 12 位 DAC,能够完成精度较高的模数/数模转换任务。
  • 灵活的电源范围:1.71 V–3.6 V 工作电压,支持多种电源方案与电池供电场景。
  • I/O 与外设:约 51 个 GPIO,配合多路定时器、PWM、以及常见通信接口(如 USART、SPI、I²C 等)可实现丰富的外设控制与通信(具体外设数量与通道请参考器件手册)。

三、开发与生态

GD32E103RBT6 与主流开发环境兼容性良好,支持使用 Keil MDK、IAR EWARM、GNU GCC 等编译工具链进行开发。器件支持标准 SWD/JTAG 调试接口,常见调试器与烧录工具均可使用。厂商提供参考手册、外设库与示例工程,可加速项目立项与开发验证。

四、典型应用场景

  • 工业控制与自动化:以其实时性能与丰富 I/O,适合电机驱动、运动控制、PLC 辅助控制等。
  • 数据采集与传感器网关:12 位 ADC/DAC 配合处理能力,可做高精度采样、滤波与控制。
  • 消费类与家电产品:响应速度与接口灵活性适合按键控制、显示驱动与通信需求。
  • 物联网终端:低电压工作与外设支持,使其可作为边缘节点或网关主控芯片。

五、设计注意要点

  • 电源与去耦:在 VDD/VSS 处靠近芯片放置 0.1 µF 与 1 µF 去耦电容,模拟参考电源(VREF)应有独立滤波以保证 ADC 性能。
  • 时钟与晶振:若使用外部晶振,注意布线并加旁路电容;对高精度采样场景建议使用低噪声时钟源。
  • ADC/DAC 布局:模拟信号线尽量短、远离数字切换线;为提高测量精度,建议在 VREF 引脚增加低 ESR 电容与清晰接地。
  • 调试接口:在开发板上预留 SWD 接口,方便下载与在线调试;在量产时可考虑保留或屏蔽以满足安全需求。
  • 封装与散热:LQFP-64(10x10)尺寸适中,注意 PCB 开窗与散热通道,确保在高频率长时间工作时稳定运行。

六、结论

GD32E103RBT6 以 Cortex-M4 性能与 128 KB Flash 的存储组合,为中高性能嵌入式应用提供了一款性价比高且应用面广的解决方案。其宽电压、丰富 I/O 与 12 位 ADC/DAC 特性,使其在工业控制、数据采集与消费电子等领域均具备良好适配性。选型时建议结合具体外设通道需求与系统功耗预算,参照官方数据手册完成最终设计验证。

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