WMSIC Electronic Components

Gigadevice MD25Q128SIGR

ModelMD25Q128SIGR
PackageSOP-8-208mil
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice MD25Q128SIGR
Type
GIGADEVICE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
MD25Q128SIGR
Electronic Component
1
Package
SOP-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.339g
Electronic Component
1
Electronic Component
BM0264863354
Electronic Component
128Mbit
Operating Voltage
2.7V~3.6V
Current
5uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD25Q128SIGR 产品概述

MD25Q128SIGR 为兆易创新(Gigadevice)推出的一款 128Mbit 串行闪存,面向对容量、速度和可靠性有均衡要求的嵌入式存储应用。器件支持标准 SPI 接口,并兼容双/四线 SPI(Dual/Quad SPI),在保持低功耗与高可靠性的同时,提供了灵活的保护机制与较高的数据保持能力,适合存储程序代码、固件与大容量只读/可改写数据。

一、产品简介

MD25Q128SIGR 容量为 128Mbit(16M 字节),工作电压范围 2.7V ~ 3.6V,标准 SPI 时钟频率 fc 为 104MHz。器件支持双 I/O 与四 I/O 传输,双 I/O 最高可达 208Mbit/s,四 I/O 与四输出模式下最高可达 416Mbit/s,满足对快速读写的需求。

二、主要特性

  • 容量:128Mbit(16MByte)
  • 接口类型:标准 SPI,支持 Dual/Quad SPI
  • 传输速率:标准 SPI 104MHz;Dual SPI 208Mbit/s;Quad/Quad Output 416Mbit/s
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:典型 5 μA(低功耗待机)
  • 擦写寿命:100,000 次(页/块擦写耐久)
  • 数据保留(TDR):20 年
  • 操作时序:页写入时间(Tpp)约 600 μs;块擦除时间(tBE)约 300 ms
  • 硬件写保护:WP# 引脚
  • 绝对写保护、写使能锁存与软件写保护(多层写保护策略)
  • 品牌:Gigadevice(北京兆易创新)

三、电气与性能要点

  • 页编程与擦除:单页编程时间典型 600 μs,整个块擦除约 300 ms。对写入密集型应用需考虑写入与擦除的时间与磨损均衡策略。
  • 可靠性:擦写寿命 10^5 次,数据保存保证 20 年,适合长期固件存储与可靠性要求较高的嵌入式系统。
  • 功耗与电源:2.7~3.6V 供电兼容常见 3.3V 系统,待机电流低至 5 μA,有助于低功耗系统设计。

四、引脚与接口说明(概述)

器件支持标准 SPI 引脚及扩展 I/O:

  • SCLK(串行时钟)
  • CS(片选)
  • I/O0(SI)
  • I/O1(SO)
  • I/O2(WP#,硬件写保护)
  • I/O3(HOLD#/RESET#,可用于暂停或复位) 在启用 Dual/Quad 模式时,I/O2/I/O3 用于数据线扩展以提升带宽。

五、典型应用场景

  • 嵌入式固件与程序存储(MCU/MPU 的外部代码/数据)
  • 消费类电子(机顶盒、智能家电、机载存储)
  • 网络设备与存储控制器(路由器、交换机引导区)
  • 工业控制与物联网终端(需要长期数据保持与低功耗)

六、设计与使用建议

  • 封装与引脚映射:本处未给出具体封装信息,应以厂商数据手册为准,设计时预留与之匹配的封装焊盘与热管理空间。
  • 写保护策略:建议结合 WP#(硬件)与软件写保护机制以防止意外擦写;关键数据区可采用绝对写保护配置。
  • 模式切换:启用 Dual/Quad 模式需在初始化协议上切换并写入相应配置寄存器,具体流程参见厂商时序与命令表。
  • 耐久与均衡:对频繁写入的应用建议进行磨损均衡(wear leveling)与日志化设计,延长器件寿命。

如需完整电气特性曲线、时序图或封装型号,请参考兆易创新官方数据手册或联系供应商获取原厂资料。

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