WMSIC Electronic Components

Gigadevice GD32E230F6P6TR

ModelGD32E230F6P6TR
PackageTSSOP-20
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD32E230F6P6TR
Type
GIGADEVICE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD32E230F6P6TR
Electronic Component
1
Package
TSSOP-20
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.244g
CPU
ARM Cortex-M
I / O
39
Electronic Component
1
ADC
10bit;8bit;6bit;12bit
Electronic Component
BM0218939928
Operating Voltage
1.8V~3.6V
CPU
72MHz
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD32E230F6P6TR 产品概述

一、产品简介

GD32E230F6P6TR 是北京兆易创新(GigaDevice)推出的一款高性能单片机(MCU),其主要特点包括工作频率达72MHz、内置6KB的SRAM和32KB的闪存,适用于各种嵌入式应用。该产品在TSSOP-20封装中提供了强大的计算能力和丰富的外设资源,适合用于消费电子、工业控制、汽车电子、物联网设备等领域。

二、技术规格

  1. 核心架构:

    • GD32E230F6P6TR基于ARM Cortex-M0+内核,支持高效的指令集,提供优异的性能与低功耗。
    • 工作频率可达到72MHz,能够在复杂的计算和实时控制中保持出色的响应速度。
  2. 存储资源:

    • 内置6KB SRAM:适合处理临时数据存储和计算任务。
    • 内置32KB闪存:提供固件和数据存储空间,支持程序的快速加载和执行。
  3. 封装与尺寸:

    • 封装形式为TSSOP-20,这种封装方式具有小巧的体积,方便在空间受限的应用中使用。
    • 该封装设计提供出色的散热性能与电气特性,使得GD32E230F6P6TR在多种环境下均能稳定运行。
  4. 工作温度范围:

    • 该产品设计支持-40°C至85°C的宽温度工作范围,适合在严苛环境条件下的应用场合。

三、外设与接口

GD32E230F6P6TR 集成了一系列丰富的外设和接口,使其能够满足各种应用需求:

  • GPIO接口:具备多个通用输入输出端口,支持灵活的I/O配置。
  • 定时器:集成多个定时器,可用于事件计数、周期性任务执行等。
  • ADC/DAC:内置模拟到数字转换器和数字到模拟转换器,满足模拟信号处理需求。
  • UART/I2C/SPI接口:支持多种通信协议,方便与外部设备进行数据交换。

四、应用领域

GD32E230F6P6TR在多个领域展现出广泛的应用潜力:

  1. 消费电子:如家用电器、智能家居控制系统等,满足低功耗与高效率的需求。
  2. 工业控制:在工厂自动化、设备监测与控制中发挥关键作用,能够进行实时处理与多任务调度。
  3. 汽车电子:适用于车载系统的信号处理与控制功能,确保系统的可靠性和安全性。
  4. 物联网:为智能传感器、控制器和数据处理终端提供强大的处理能力,支持无线通信与远程监控。

五、开发支持

为了帮助开发者快速上手,GigaDevice 提供了丰富的技术支持和开发工具:

  • 开发板:支持GD32E230F6P6TR的开发板可用,方便开发者进行原型设计和测试。
  • 软件开发工具链:包括Keil、IAR、GCC等常用开发工具的支持,简化了软件开发过程。
  • 示例代码与文档:提供全面的开发文档、应用示例和库,帮助开发者理解和使用MCU功能。

六、总结

GD32E230F6P6TR作为一款高性能的单片机,凭借其强大的处理能力、丰富的外设设计以及灵活的应用范围,适用于当今多样化的电子产品开发需求。无论是在消费电子、工业控制还是物联网应用中,GD32E230F6P6TR都能凭借其卓越的性能和灵活性,为开发者提供技术优势,帮助其在激烈的市场竞争中立于不败之地。

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