WMSIC Electronic Components

Gigadevice MD25Q128SIG

ModelMD25Q128SIG
PackageSOIC-8-208mil
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice MD25Q128SIG
Type
GIGADEVICE
Minimum package
9500 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
MD25Q128SIG
Electronic Component
1
Package
SOIC-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0264239963
Electronic Component
128Mbit
Operating Voltage
2.7V~3.6V
Current
5uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD25Q128SIG 串行SPI Flash存储器产品概述

MD25Q128SIG是北京兆易创新(Gigadevice)推出的一款128Mbit(16MB)串行SPI接口Flash存储器,采用SOIC-8-208mil封装,具备高读写性能、低功耗及长寿命等核心特性,广泛适配消费电子、工业控制、通信设备等多领域的固件存储、数据日志及临时数据存储需求。

一、产品定位与核心特性

MD25Q128SIG定位于中容量、高性价比的串行Flash,核心特性可总结为:

  1. 串行SPI接口:兼容标准SPI协议(模式0/3),可与主流MCU(如STM32、GD32等)直接对接,无需额外电平转换;
  2. 高读写性能:最高时钟频率104MHz,页写入时间仅600us,32KB块擦除时间200ms,满足高速数据传输需求;
  3. 低功耗设计:工作电压覆盖2.7V~3.6V,待机电流低至5uA,适配电池供电或低功耗设备;
  4. 长寿命可靠性:擦写寿命达100000次,数据保留时间20年,可应对频繁擦写及长期数据存储场景;
  5. 小体积封装:SOIC-8-208mil窄体封装,尺寸约5.2mm×4.0mm,节省PCB布局空间,适配小型化产品设计。

二、关键技术参数详解

2.1 容量与接口

  • 存储容量:128Mbit(即16MB),内部划分为512个32KB块(或256字节/页的页结构),支持按块/页擦写;
  • 接口类型:标准SPI串行接口,支持单SPI模式,部分应用可通过双/四SPI模式(兆易创新通用扩展特性)进一步提升读写速度。

2.2 性能参数

  • 时钟频率:最高104MHz,可向下兼容52MHz、26MHz等速率,适配不同系统带宽需求;
  • 写入/擦除:单页(256字节)写入时间600us,32KB块擦除时间200ms,扇区擦除(若需)可实现更快操作;
  • 寿命与保留:块擦除/页写入寿命100000次,25℃环境下数据保留20年,满足长期数据存储可靠性。

2.3 功耗与电源

  • 工作电压:2.7V~3.6V,覆盖多数MCU的供电范围,无需额外电源转换;
  • 待机电流:典型值5uA,休眠模式下电流进一步降低(兆易创新通用特性),适合电池供电设备(如智能传感器);
  • 工作电流:104MHz时钟下典型值10mA,读写过程电流稳定,无明显浪涌。

2.4 封装形式

  • 封装类型:SOIC-8-208mil(窄体),引脚间距1.27mm,符合IPC焊接规范,易批量生产。

三、典型应用场景

MD25Q128SIG的参数特性使其适配以下场景:

  1. 消费电子:智能家居设备(如智能灯、温湿度传感器)——低待机电流保证长期待机,16MB容量存储固件及历史数据;便携式音频设备(如蓝牙音箱)——小封装节省空间,高读写速度支持快速音频读取;
  2. 工业控制:工业传感器节点(压力/温度传感器)——宽电压适配工业电源波动,长寿命应对长期数据采集;小型PLC——存储控制程序及运行日志,10万次擦写满足频繁程序更新;
  3. 通信设备:路由器/交换机——高时钟支持快速固件升级,16MB容量存储系统配置及日志;无线AP——存储无线配置及用户数据,低功耗减少设备能耗;
  4. 其他领域:医疗电子(小型监护仪)——20年数据保留满足医疗数据合规要求;智能穿戴(手环/手表)——小封装适配小型化设计,低待机电流延长续航。

四、设计注意事项

  1. 电源稳定:需保证工作电压在2.7V~3.6V范围内,避免电压波动超过±0.1V,防止器件损坏;
  2. 焊接规范:回流焊温度不超过260℃(时间≤30秒),手工焊接温度≤350℃(时间≤3秒),避免过温导致封装失效;
  3. 时序要求:遵循兆易创新SPI时序规范(如CS片选建立时间≥10ns),确保读写操作稳定;
  4. 寿命优化:避免频繁擦写单个块,采用循环擦写策略(如按块轮循)延长整体寿命;擦写操作需等待状态寄存器确认完成,避免中途中断。

五、总结

MD25Q128SIG作为兆易创新的主流SPI Flash产品,以128Mbit容量、104MHz高时钟、低待机电流及长寿命为核心优势,搭配紧凑的SOIC-8封装,覆盖了消费电子、工业控制等多领域的存储需求,是一款性价比高、可靠性强的串行Flash存储器,适合各类中容量存储场景的设计选型。

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