WMSIC Electronic Components

Gigadevice GD25WD05CEIGR

ModelGD25WD05CEIGR
Package8-USON(2x3)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD25WD05CEIGR
Type
GIGADEVICE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD25WD05CEIGR
Electronic Component
1
Package
8-USON(2x3)
Electronic Component
NOR FLASH
Electronic Component
0.065g
Electronic Component
1
Electronic Component
BM0264738437
Electronic Component
512Kbit
Operating Voltage
1.65V~3.6V
Current
0.1uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
100MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD25WD05CEIGR NOR FLASH存储器产品概述

GD25WD05CEIGR是北京兆易创新(Gigadevice)推出的一款小容量高速SPI四I/O NOR FLASH存储器,针对对存储容量需求适中、传输速度要求较高、封装尺寸敏感的应用场景设计,兼具低功耗、高可靠性与工业级环境适应性,是嵌入式系统、物联网终端等领域的理想存储解决方案。

一、产品定位与核心特性

该产品属于兆易创新NOR FLASH产品线中的入门级高速系列,核心定位为**“小封装·高速度·低功耗”**,可满足多数嵌入式设备的程序存储与数据缓存需求。其核心特性包括:

  • 512Kb(64K×8)非易失性存储容量,适配小型MCU程序与参数存储;
  • 支持SPI四I/O(Quad SPI)接口,传输效率显著高于普通SPI;
  • 100MHz高速时钟,最大传输速率可达400Mbps;
  • 1.65V~3.6V宽电压供电,兼容主流MCU的供电范围;
  • -40℃~85℃工业级工作温度,适应恶劣环境;
  • 8-USON(2×3mm)超小型封装,大幅节省PCB空间。

二、关键参数详解

2.1 存储容量与架构

GD25WD05CEIGR采用统一扇区架构,总容量为512Kb(即64K字节),以8位(1字节)为基本读写单位,扇区大小为4Kb(512字节),支持按扇区、块或整片擦除,方便用户根据需求灵活管理存储区域。

2.2 供电与功耗

供电电压范围覆盖1.65V~3.6V,可兼容1.8V、3.3V等主流MCU供电方案;功耗表现优异:

  • 待机模式电流<1μA,休眠模式电流<0.1μA,适合低功耗电池供电设备;
  • 读写操作时的峰值电流<10mA,不影响系统整体功耗。

2.3 可靠性参数

  • 擦写寿命:典型值≥10万次(扇区擦写),满足长期使用需求;
  • 数据保持时间:常温下≥20年,确保存储数据的长期可靠性;
  • 抗干扰能力:支持ESD防护(HBM≥2kV、MM≥200V),提升产品在复杂环境下的稳定性。

三、接口与性能优势

3.1 SPI四I/O接口设计

相比传统SPI接口(仅2根数据线),GD25WD05CEIGR支持四I/O模式(4根数据线:DQ0DQ3),可在一个时钟周期内同时收发4位数据,传输效率提升24倍。同时兼容普通SPI模式,方便与不同MCU接口适配。

3.2 高速传输性能

最高时钟频率达100MHz,四I/O模式下最大传输速率可达400Mbps,可快速完成程序加载与数据读写,适合需要实时响应的嵌入式系统(如智能穿戴、物联网传感器)。

3.3 指令集兼容性

兼容兆易创新NOR FLASH通用指令集,支持读、写、擦除、状态查询等基本指令,同时扩展了快速读、四I/O读等高速指令,便于用户快速集成到现有系统中。

四、封装与应用适配性

4.1 超小型封装

采用8-USON(2×3mm)封装,尺寸仅为传统8引脚SOIC封装的1/5左右,大幅节省PCB布局空间,特别适合便携式设备(如智能手环、蓝牙耳机)、小型家电控制器等对尺寸敏感的场景。

4.2 环境适应性

  • 工作温度范围:-40℃~85℃(工业级),可在低温环境(如户外传感器)与高温环境(如车载辅助系统)稳定工作;
  • 封装可靠性:USON封装采用无引脚设计,抗振动、抗冲击能力强,适合车载、工业控制等振动环境。

五、典型应用场景

GD25WD05CEIGR凭借小容量、高速、小封装的优势,广泛应用于以下领域:

  1. 便携式电子设备:智能手环、蓝牙耳机、智能手表的程序存储与参数配置;
  2. 物联网终端:低功耗传感器节点、智能家居控制器的本地数据缓存;
  3. 消费电子:小型家电(如智能插座、遥控器)、玩具的程序存储;
  4. 工业控制:小型PLC、电机控制器的辅助存储(如固件升级、参数备份);
  5. 车载电子:车载USB设备、仪表盘辅助存储(温度范围适配车载环境)。

总结而言,GD25WD05CEIGR是一款性价比突出的高速SPI四I/O NOR FLASH,在小容量存储场景中实现了“速度、尺寸、功耗”的平衡,是嵌入式系统设计的可靠选择。

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