WMSIC Electronic Components

Gigadevice GD25D10CKIGR

ModelGD25D10CKIGR
Package8-USON(1.5x1.5)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD25D10CKIGR
Type
GIGADEVICE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD25D10CKIGR
Electronic Component
1
Package
8-USON(1.5x1.5)
Electronic Component
NOR FLASH
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0264800960
Electronic Component
1Mbit
Operating Voltage
2.7V~3.6V
Current
0.1uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
100MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD25D10CKIGR 1Mb SPI NOR Flash 产品概述

GD25D10CKIGR是北京兆易创新推出的一款1Mb容量SPI双I/O接口NOR Flash,属于非易失性存储器件,专为对空间、功耗及可靠性有严格要求的小型电子设备设计。产品采用超小尺寸封装,具备宽电压范围、工业级温度适应性,可满足消费电子、工业控制、物联网等多领域的存储需求。

一、产品核心定位与基础特性

该产品的核心定位是小容量高密度存储解决方案,针对传统SPI Flash在速度和封装体积上的优化:

  • 采用SPI双I/O(SPI Dual I/O)接口,相比标准SPI可实现更高数据传输速率(时钟频率100MHz时,有效传输速率可达200Mbps);
  • 1Mb存储容量(128K字节×8位),满足小型固件、配置参数、校准数据等存储需求;
  • 非易失性设计,掉电后数据可长期保持,无需额外供电;
  • 低功耗特性,适合电池供电的便携式设备(典型待机电流<1uA,工作电流<10mA)。

二、关键参数深度解析

2.1 存储与接口参数

  • 容量:1Mb(128K×8位),支持按字节、页、扇区操作;
  • 接口:SPI双I/O,包含CS#(片选)、SCK(时钟)、DQ0-DQ3(数据I/O,双I/O模式下同时用两个线传输数据);
  • 时钟频率:最高100MHz,保障高速数据读写。

2.2 供电与环境适应性

  • 供电电压:2.7V~3.6V宽范围,兼容常见MCU(如STM32低电压系列)的供电系统;
  • 工作温度:-40℃~85℃(工业级温度范围),可适应户外、车载等 harsh环境。

2.3 擦写与可靠性参数

  • 写周期:字写50μs(单个字节写入时间)、页写4ms(每页256字节写入时间,兆易GD25系列典型页大小);
  • 擦除:支持扇区擦除(4KB扇区,擦除时间<50ms)、块擦除(32KB/64KB块)、整片擦除;
  • 数据保持:10年以上(25℃环境);
  • 擦写次数:10万次以上(扇区擦除次数)。

三、封装与安装方式

GD25D10CKIGR采用8-USON封装(1.5mm×1.5mm,引脚间距0.5mm),属于表面贴装型(SMD):

  • 超小体积:相比传统8-SOIC封装体积缩小约70%,极大节省PCB空间;
  • 安装要求:需采用回流焊工艺,适合自动化批量生产;
  • 引脚定义:包含片选(CS#)、时钟(SCK)、数据I/O(DQ0-DQ3)、电源(VCC)、地(GND)等8个引脚,兼容常见SPI Flash引脚布局。

四、典型应用场景

该产品因体积小、速度快、可靠性高,广泛应用于以下场景:

  1. 便携式消费电子:智能手环、蓝牙耳机、智能手表的固件存储(需小容量高速读写);
  2. 小型工业模块:传感器节点(温湿度、加速度传感器)的配置数据存储,PLC辅助控制器的参数保存;
  3. 物联网终端:低功耗IoT设备(智能门锁、插座)的程序存储,保障掉电数据不丢失;
  4. 汽车电子辅助单元:车载USB模块、后视镜控制器的小型存储需求(工业级温度适配车载环境);
  5. 医疗小型设备:便携式血糖仪、血压计的校准数据存储(需稳定可靠的非易失存储)。

五、品牌与产品优势

兆易创新作为国内领先的存储芯片设计厂商,GD25D10CKIGR具备以下优势:

  • 成熟产品线:GD25系列是兆易核心NOR Flash产品线,经过多年市场验证,供货稳定;
  • 环保合规:符合RoHS、REACH等国际环保标准,无铅无卤;
  • 技术支持:提供完整的datasheet、参考设计及技术咨询,方便客户快速集成;
  • 成本优势:相比进口同类产品,在性能相当的情况下具备更具竞争力的价格。

综上,GD25D10CKIGR凭借小体积、高速SPI双I/O、工业级可靠性等特点,成为小型电子设备存储方案的优选,可有效平衡空间、性能与成本需求。

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