Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0201X5R105M6R3ET
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0201X5R105M6R3ET
- Type
- HRE
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0201X5R105M6R3ET
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264596052
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0201X5R105M6R3ET 贴片多层陶瓷电容（MLCC）产品概述
CGA0201X5R105M6R3ET是HRE（芯声）品牌针对小型化低功耗电子设备优化的贴片多层陶瓷电容（MLCC），以超小封装、稳定容值及高可靠性为核心优势，适配便携式消费电子、物联网终端等场景的电路需求。
一、产品基本属性与型号解析
该产品属于无极性贴片MLCC，通过多层陶瓷介质叠层工艺实现高容量密度，型号各部分含义明确：
- CGA：HRE品牌标准MLCC系列前缀，标识通用陶瓷电容产品线；
- 0201：英制封装规格（0.02英寸×0.01英寸），对应公制尺寸约0.60mm×0.30mm，是当前紧凑电路的主流超小封装；
- X5R：温度系数代码，代表工作温度范围为-55℃~+85℃，容值变化幅度≤±15%；
- 105M：容值与精度标识，105=10×10⁵pF=1μF，M为精度代码（±20%）；
- 6R3：额定直流电压（DC）6.3V，针对低功耗设备设计；
- ET：生产批次及工艺后缀，确保同批次产品性能一致性。
二、核心性能参数详解
该产品参数精准匹配中低端便携设备需求，关键指标如下：
参数项 规格值 应用备注 容值（Capacitance） 1μF（10⁶pF） 满足滤波、耦合、去耦的基础容量需求 精度（Tolerance） ±20%（M级） 适用于对精度要求不苛刻的通用电路 额定电压（Rated Voltage） 6.3V DC 避免低功耗设备过压风险，兼容3.7V锂电池系统 温度系数（TC） X5R -55℃~+85℃，容值波动≤±15%，稳定性可靠 封装尺寸（Package） 0201（英制） 长0.60±0.05mm，宽0.30±0.05mm，厚0.30±0.05mm 介质类型（Dielectric） 多层陶瓷（MLCC） 低ESR（等效串联电阻）、无极性、高容量密度三、典型适用应用场景
因超小封装、1μF容值及6.3V低电压特性，该产品主要用于紧凑空间、低功耗场景：
- 便携式消费电子：智能手机主板射频前端滤波、蓝牙模块耦合电容、智能手环电源去耦；
- 物联网（IoT）终端：温湿度传感器节点信号滤波、低功耗WiFi模块电源稳压辅助；
- 可穿戴设备：智能手表心率监测电路耦合、无线充电模块滤波；
- 小型电子模块：蓝牙5.0模块、ZigBee模块射频信号匹配电容；
- 智能家居配件：智能插座控制电路去耦、遥控器按键信号滤波。
四、可靠性与环境适应性
HRE对该产品可靠性管控严格，符合多项行业标准：
- 温度稳定性：X5R介质在-55℃~+85℃范围内，容值波动不超过±15%，适配户外传感器（如农业监测）；
- 耐环境性能：通过IEC 60068-2-67（恒定湿热40℃/93%RH，96h）测试，应对潮湿环境；
- 机械可靠性：焊点强度符合J-STD-020标准，抗振动（10~2000Hz，1.5g）及冲击（1000m/s²，6ms），适合移动设备；
- 环保合规：符合RoHS 2.0及REACH法规，不含铅、镉等有害物质，可出口欧盟、北美市场。
五、品牌与品质保障
HRE（芯声）是国内专注MLCC研发的企业，该产品具备：
- 产能稳定：月产能千万级，满足批量生产需求；
- 品质管控：ISO 9001认证，每批次抽检容值、电压、温度特性；
- 技术支持：提供电路设计建议，优化滤波/耦合电路；
- 售后保障：1年保质期，批量订单可提供样品测试。
该产品凭借超小封装、稳定性能及高性价比，成为便携电子、IoT终端的优选MLCC，适配主流SMT生产线，安装效率高。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
