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HRE CGA0402X7R103K500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0402X7R103K500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402X7R103K500GT
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0265109112
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X7R103K500GT — HRE(芯声) 0402 10nF ±10% 50V X7R 贴片电容产品概述
一、产品简介
CGA0402X7R103K500GT 为 HRE(芯声) 系列多层陶瓷贴片电容（MLCC），额定电压 50V，标称容值 10nF（103），公差 ±10%（K），介质型式 X7R，封装 0402（约 1.0 × 0.5 mm）。适用于高密度贴装电路中的去耦、滤波、耦合与储能等场合。
二、主要参数
- 容值：10nF（103）
- 公差：±10%（K）
- 额定电压：50 V DC
- 介质：X7R（-55°C ～ +125°C，温度系数典型为 ±15%）
- 封装：0402（约 1.0 × 0.5 mm）
- 极性：无极性；适合双向使用
- 符合 RoHS / 无铅回流工艺（推荐按 J-STD-020 回流曲线）
三、产品特性
- 体积小、容值稳定、适合高密度 PCB 设计
- X7R 属 II 类介质，兼顾容值与温度稳定性，适合一般去耦与滤波应用
- 在直流偏压和温度变化下容值会有所下降，设计时应预留裕量
- 低等效串联电阻（ESR）与良好谐振性能，适合瞬态响应需求
四、典型应用
- 数字电路与电源去耦、旁路电容
- DC-DC 转换器输入/输出滤波
- 模拟电路耦合/去耦
- 移动设备、消费电子、通信模块和高密度工业板卡
五、安装与可靠性建议
- 推荐按厂家推荐的焊盘尺寸与回流曲线焊接，避免过热或多次回流导致裂纹
- 在 PCB 布局时避免在焊盘下方留下切口或深槽，减少焊接应力集中
- 对关键稳定性应用，应考虑偏压下的容量下降与温漂，必要时选用更高容值或更高等级介质
- 存储时避免潮湿与机械挤压，贴片在剪切或弯曲板材时易产生微裂纹影响可靠性
六、选型与订购提示
型号命名中 103 = 10nF，K = ±10%，500 常用于表示 50V 额定。下单时请确认封装 0402、工作温度范围及是否需特殊终端或包装（卷带/托盘）。如需更高稳定性或低偏压效应，可选 C0G/NP0 或更大封装型号以满足系统要求。
如需样品及详细数据手册（包括等效电路、温度/频率/偏压特性曲线和焊接推荐），可联系 HRE(芯声) 或指定代理商提供标准资料。
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