Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CSA0402X7R103K500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402X7R103K500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402X7R103K500GT
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778579
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402X7R103K500GT 产品概述
一、产品简介
CSA0402X7R103K500GT 为 HRE(芯声) 系列贴片多层陶瓷电容（MLCC），规格为 0402 封装，标称电容 10nF，公差 ±10%（K），额定电压 50V，温度特性 X7R。该产品针对高密度表贴电路设计，兼顾体积、性能与成本，适合大批量自动化贴装生产。
二、主要参数
- 容值：10nF
- 公差：±10%（K）
- 额定电压：50V DC
- 温度系数：X7R（适用宽温环境）
- 封装：0402（公制 1005 或 0.4mm × 0.2mm 级别）
- 类型：多层陶瓷电容（MLCC）
三、产品特点
- 尺寸小、占板面积低，利于高密度布局与微型化产品设计；
- X7R 介质在宽温范围内稳定性良好，适合电源去耦、旁路与滤波应用；
- 50V 额定电压为常见模拟与数字电路提供充足余量，提高可靠性；
- HRE 品牌生产工艺成熟，适配自动贴装与回流焊工艺，便于量产。
四、典型应用
- 数字电源去耦与旁路（微处理器、FPGA、ASIC 等附近）；
- 模拟电路耦合、滤波与旁路（放大器、ADC/DAC 前端）；
- 移动与便携设备、消费电子、通信设备、工业控制板等需要高密度贴片的场景；
- 高频去耦及电源稳定系统中作为分布式旁路电容。
五、封装与装配建议
- 采用标准 SMT 回流焊工艺，建议遵循 PCB 焊盘设计规范以减少机械应力；
- 0402 为微小封装，贴装与回流过程中应注意防止过度机械应力及热冲击；
- 对于高可靠性应用，建议进行合理的焊盘过孔布局与应力缓冲设计，以降低焊接后裂纹风险；
- 储存与拣取时注意防潮处理与静电防护（ESD）。
六、质量与选型提示
在选型时建议参考 PCB 布局空间、电容温漂需求与工作电压裕度。对于需要更严格温度稳定性的应用，可考虑温度系数更高精度的介质或并联/串联组合方案。欲获取样品、批量报价或详细可靠性报告（如寿命试验、机械冲击等），可联系 HRE(芯声) 或其授权分销渠道获取最新资料与支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
