WMSIC Electronic Components

HRE CGA0201C0G150J500ET

ModelCGA0201C0G150J500ET
Package0201
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0201C0G150J500ET
Type
HRE
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0201C0G150J500ET
Electronic Component
1
Electronic Component
15pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0265156232
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0201C0G150J500ET 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

CGA0201C0G150J500ET是HRE(芯声) 品牌推出的贴片多层陶瓷电容(MLCC),专为精密高频电路设计。型号标识解析清晰:

  • CGA:HRE芯声MLCC产品系列代码;
  • 0201:英制封装尺寸(0.02英寸×0.01英寸);
  • C0G:EIA温度特性代码(对应IEC NP0类);
  • 150:标称容值(15×10⁰=15pF);
  • J:容值精度代码(±5%);
  • 500:额定电压(50V DC);
  • ET:端电极/包装规格(无铅环保镀层)。

二、核心电气性能参数

该产品的电气性能聚焦稳定性、高频特性,关键参数如下:

  1. 容值与精度:标称15pF,精度±5%,全温度范围内容值偏差极小;
  2. 额定电压:50V DC,满足多数中低压电路需求;
  3. 温度系数:C0G材质,温度系数为0±30ppm/℃(1kHz, 25℃),容值随温度变化可忽略;
  4. 高频损耗:损耗角正切值(tanδ)典型值<0.15%,适合射频信号传输,无额外信号衰减;
  5. 绝缘电阻:≥10¹⁰Ω(25℃, 50V DC),长期工作无漏电流隐患。

三、封装与物理特性

采用0201小型化封装,适配高密度PCB布局,公制尺寸为:

  • 长度:0.508±0.025mm;
  • 宽度:0.254±0.025mm;
  • 高度:≤0.25mm(典型值0.20mm);
  • 端电极:镍底层+无铅锡镀层,符合RoHS/REACH环保指令,可焊性优异(焊接温度260℃/10s)。

四、适用典型应用场景

基于C0G材质的高稳定性、低损耗及0201封装的小型化优势,该产品广泛用于:

  1. 射频通信模块:蓝牙、WiFi、5G小基站的滤波、耦合电路,避免温度变化导致的信号偏移;
  2. 精密测量仪器:医疗监护设备、示波器的信号调理电路,确保测量精度一致性;
  3. 消费电子终端:智能手机、智能手表的射频前端、时钟振荡电路,适配便携设备的紧凑空间;
  4. 工业控制电路:PLC、传感器模块的抗干扰滤波,宽温度范围(-55℃~125℃)适应工业环境。

五、可靠性与环境适应性

HRE芯声通过严格工艺控制,确保产品长期可靠性:

  • 温度范围:工作温度-55℃+125℃,存储温度-40℃+85℃;
  • 耐环境测试:通过MIL-STD-202湿度测试(85℃/85%RH, 1000h)、振动测试(20Hz~2000Hz, 1.5g);
  • 寿命特性:额定条件下平均无故障时间(MTBF)>10⁶小时,抗机械应力(PCB弯曲≤5mm)性能优异;
  • 一致性:全批次容值、损耗一致性控制在±2%内,减少批量应用的参数偏差。

六、品牌与品质保障

HRE芯声作为国内MLCC领域的专业制造商,该产品具备:

  • 工艺优势:采用先进的多层陶瓷叠层技术,电极层均匀性达μm级;
  • 环保合规:无铅端电极符合欧盟RoHS 2.0、REACH SVHC要求;
  • 品质体系:通过ISO 9001、IATF 16949认证,全流程电性能测试,不良率控制在ppm级;
  • 技术支持:提供选型、应用方案设计支持,适配客户定制化需求。

该产品平衡了小型化、高稳定性、可靠性,是精密电子设备中替代进口MLCC的高性价比选择。

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