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HRE(芯声) CSA0402C0G180J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G180J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G180J500GT
- Electronic Component
- 1
- Electronic Component
- 18pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778573
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G180J500GT 产品概述
一、产品简介
CSA0402C0G180J500GT 为 HRE（芯声）品牌的贴片多层陶瓷电容（MLCC），标称电容值 18 pF，容量公差 ±5%，额定电压 50 V，介质为 C0G（又称 NP0）。采用 0402（约 1.0 mm × 0.5 mm）超小型封装，适用于对温度稳定性、频率特性和低损耗有较高要求的电路设计。
二、主要性能与参数
- 容值：18 pF；公差：±5%（J）
- 额定电压：50 V DC
- 介质类型：C0G/NP0（温度系数接近 0 ppm/°C，常见定义为 0 ±30 ppm/°C，具有极好的线性与稳定性）
- 封装：0402（贴片）
- 电性能特点：介质损耗低、等效串联电阻（ESR）与等效串联电感（ESL）小、Q 值高，频率响应好，适用于射频与高精度模拟电路。
- 长期稳定性：C0G 无明显老化效应，长期容值漂移小，适合做定时、耦合与匹配元件。
三、典型应用场景
- 高频和射频电路（滤波、阻抗匹配、谐振回路）
- 高频去耦与旁路（在高频段表现优异）
- 振荡器与时钟电路（需要稳定容值的定时网络）
- 精密模拟电路（采样、放大和仪表前端）
- 通信、射频模块、传感器接口等空间受限的电子产品
四、封装与机械注意事项
0402 为超小尺寸封装，适合高密度 PCB 布局。由于尺寸小，机械应力敏感，推荐按制造商建议的 PCB 焊盘尺寸与焊接工艺布局。贴片装配建议使用高速贴装设备，回流焊工艺应遵循器件的回流温度曲线，避免过度加热与机械应力导致裂纹。
五、可靠性与工艺建议
- 温度稳定：C0G 介质在宽温度范围内保持极小容值变化，适合对稳定性要求高的应用。
- 抗振动与抗冲击：小尺寸有利于抗振，但在装配与维修时须避免弯折、刮擦或局部应力。
- 焊接与回流：按厂商回流曲线进行分段升温与冷却，若包装或物料说明有湿敏等级（MSL），按相应要求预烘烤处理。
- 储存：避免潮湿与强酸碱气体环境，开卷后若长时间放置，按制造商建议处理以防焊接缺陷。
六、选型建议与替代方案
如需更高电压或更大容量，可选择同系列更大封装（例如 0603、0805）。若对温度系数要求不高且需更高介电常数以获得更大容量，可考虑 X7R、X5R 等介质，但要注意其有明显老化与温度漂移。选型时应兼顾频率特性、ESR/ESL、封装尺寸与可靠性要求。
七、订购与包装信息
型号：CSA0402C0G180J500GT；品牌：HRE（芯声）。GT 后缀通常表示卷带（tape & reel）包装，便于 SMT 自动贴装。具体最小订购量、包装卷数与交货周期请以供应商报价单或厂家规格书为准。
如需详细电气参数（如介质损耗角正切、工作温度范围、回流曲线、推荐 PCB 焊盘尺寸等），建议索取并参照 HRE 官方数据手册与应用笔记以获得最精确的设计与工艺指导。
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