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HRE CGA0201C0G2R4B500ET
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- HRE CGA0201C0G2R4B500ET
- Type
- HRE
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0201C0G2R4B500ET
- Electronic Component
- 1
- Electronic Component
- 2.4pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0265109124
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0201C0G2R4B500ET — HRE(芯声) 0201 C0G 2.4pF 陶瓷电容产品概述
一、产品概况
CGA0201C0G2R4B500ET 是 HRE(芯声) 推出的超小型 0201（约0.6mm × 0.3mm）片式多层陶瓷电容，标称容值 2.4 pF，额定电压 50 V，介质类型为 C0G（亦称 NP0，Class 1）。该系列以极高的温度稳定性、极低的介质损耗和优异的高频性能为特点，适合对精度与稳定性要求高的小尺寸电路应用。
二、主要电气特性
- 容值：2.4 pF（标称）
- 额定电压：50 V
- 温度系数：C0G（近似 0 ppm/°C，典型温漂在 ±30 ppm/°C 量级）
- 介质损耗：非常低（适合高频、射频及高精度测量场合）
- 高频特性：低等效串联电感（ESL）与低等效串联电阻（ESR），自谐振频率高，利于射频匹配与高频滤波
三、封装与机械特征
- 封装规格：0201（约 0.6 mm × 0.3 mm），厚度视具体型号可略有差异
- 单位体积电容值小，但体积优势明显，适用于高密度贴装设计
- 对贴装精度和取放设备要求较高，需采用细嘴吸嘴和精准贴装工艺
四、典型应用场景
- 射频前端：阻抗匹配、谐振回路、滤波网络
- 高频信号路径：振荡器、谐振腔、微波电路中的耦合/分支元件
- 精密测量与时钟电路：对温漂和非线性敏感的微小电容场合
- 紧凑型消费电子与可穿戴设备：在有限空间内实现高密度布板
五、PCB 布局与焊接建议
- 高频路径应尽量缩短连线，电容两端尽量靠近被旁路或耦合的器件引脚放置；返回路径要靠近地平面并打过孔分流。
- 0201 器件对焊膏量和模板开孔敏感，请参照厂商推荐的焊膏印刷工艺，避免过量或不足导致焊接缺陷。
- 兼容无铅回流工艺；建议按照 PCB 制造与组装良好规范控制回流曲线及温度峰值。
- 贴装与焊接后建议进行目视/自动光学检测（AOI）与必要的电气测试以保证良率。
六、可靠性与储存
- C0G（Class 1）陶瓷介质本身具有优良的长期稳定性和低失真，适合对性能漂移要求严格的应用。
- 0201 体积微小，建议按干燥箱/防潮包装要求存放，贴片卷带在超过推荐的回流前需进行回烘处理以防焊接问题。
- 建议在设计与量产前与供应商确认产品的电气参数公差、包装形式与相关可靠性测试报告。
七、选型与采购提示
- 在选型时确认容值容差、介质等级与温漂需求；若需更大容值或更高电压等级，可考虑同系列其它规格。
- 订购时请关注包装形式（卷带/盘带）、批号及质检报告；大批量生产建议申请样片验证温度循环、振动与回流可靠性。
总结：CGA0201C0G2R4B500ET 以其极小封装与 C0G 的优越电性能，适合高频与高精度微型电路，是射频匹配、振荡与精密测量等领域的优选器件。选型与生产过程请结合实际电路特性与装配能力，遵循厂商工艺建议以保证性能与良率。
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