Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X7R222K500GT(品牌:HRE/芯声)是一款贴片多层陶瓷电容(MLCC),额定电容为2.2nF(2200pF),公差±10%(K),额定电压50V,介质材料为X7R,封装为0402(典型尺寸约1.0mm × 0.5mm)。X7R介质保证了器件在-55°C至+125°C温度范围内的温度特性,适用于一般旁路、去耦与滤波场合。
X7R属于Ⅱ类介质,具有容量-温度与容量-电压非线性特性:在高温或施加直流偏压时电容会下降,具体降幅与片式尺寸、加工工艺有关,典型在高偏压下可能出现10%40%的容量衰减。设计时应考虑电压去额定或采取降额使用策略(视可靠性要求通常建议在额定电压的50%80%区间使用)。X7R允许的温度系数为-15%~+15%(-55°C至+125°C)。
适合用于:电源去耦与旁路、电源滤波、信号耦合(非常规高精度场合慎用)、输入/输出滤波、移动终端、通讯设备、工控与消费电子中对体积和中等容量要求的场合。若电路对电容稳定性、低损耗或高精度有更高要求,应考虑C0G(NP0)或更高等级材料。
常规出厂测试包括容量与容差、漏电流、绝缘电阻、耐压、温循环与热冲击、湿热试验等。长期可靠性与寿命受工作电压、温度与机械应力影响,关键应用建议与供应商确认加速寿命测试数据并按需进行额外验证。
型号:CGA0402X7R222K500GT(HRE/芯声)。选型时关注工作电压裕度、温漂需求与DC偏置影响;批量采购可向供应商索取样片和器件性能曲线(容量随电压、温度的变化曲线)、回流工艺建议书及可靠性报告,以便在设计验证阶段完成必要的定制化评估。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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