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HRE CSA0402X5R105M250GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402X5R105M250GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402X5R105M250GT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778599
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402X5R105M250GT 产品概述
一、产品简介
CSA0402X5R105M250GT 是芯声（HRE）推出的一款高容值多层陶瓷电容器，规格为 0402(1005 公制)，标称容量 1µF，公差 ±20%，额定电压 25V，介质材料为 X5R。该系列针对高密度贴片电路的去耦、滤波与旁路应用进行了优化，在体积极小的前提下提供较高的电容量，适合移动终端、通信模块、消费电子及工业控制等对体积和性能有要求的电路设计。
二、主要技术参数
- 容值：1µF
- 公差：±20%
- 额定电压：25V DC
- 介质：X5R（温度范围典型 -55°C 至 +85°C）
- 封装：0402（公制 1.0mm × 0.5mm）
- 品牌：HRE（芯声）
- 产品型号：CSA0402X5R105M250GT
三、材料与性能要点
X5R 介质在常温下具有较好的电容量-温度稳定性，但并非 NP0/C0G 型的线性稳定，温度系数允许在 ±15% 范围内随温度变化；另外，陶瓷电容对直流偏压（DC bias）敏感，在高工作电压下电容量会出现下降，尤其是薄介质高电容的小尺寸器件，设计时建议预留裕量或进行实际测量验证。该型号在频率响应、等效串联电阻（ESR）和等效串联电感（ESL）上适合一般去耦与滤波场合。
四、典型应用场景
- 电源去耦与旁路（I/O、电压稳压器输入/输出）
- 高频滤波、去耦网格与阻抗控制线路
- 移动通信终端、蓝牙/Wi‑Fi 模块电源线路
- 消费类电子、穿戴设备与小型传感器模块
- 工业控制板卡对体积与成本敏感的去耦需求
五、封装、安装与工艺建议
- 尺寸：0402（1005），焊盘设计请参考厂家推荐焊盘尺寸以确保良好焊接可靠性。
- 回流焊：建议采用无铅回流曲线，最高峰值温度依据 J‑STD‑020 标准（250–260°C），并根据 PCB 与元件厚度适当调整预热与冷却曲线。
- 贴片注意：0402 体积小，贴装时需使用精确贴片机与对应吸嘴，避免振动、错位。
- 设计建议：考虑 X5R 的温度与 DC bias 特性，在电源旁路设计中可并联不同容值与温度特性的电容以提高低频与高频性能。
六、可靠性与品质保证
芯声（HRE）出品，提供出厂电气测试与外观检验，常见可靠性验证包括高温储存、温度循环、湿热试验与焊接热冲击测试。对于关键应用（如汽车级、医疗级）建议与供应商确认具体认证与批次试验结果。
七、订购信息与注意事项
产品型号 CSA0402X5R105M250GT，订购时请注明所需包装方式（卷装、盘装）与批号要求。设计前请参考最新型号资料与样品实测数据，若应用在高工作电压且对电容量稳定性有严格要求，建议进行 DC bias 与频率响应的实测评估。若需替代或并联优化方案，可与技术支持沟通具体电路条件以获得匹配建议。
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