Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402C0G150J500GT 是 HRE(芯声)推出的一款高稳定性片式多层陶瓷电容(MLCC),额定容量 15 pF,容差 ±5%(J),额定电压 50 V,采用 C0G(也称 NP0)介质材料。0402 封装(约 1.0 mm × 0.5 mm)实现了小体积与稳定电性能的平衡,适用于对温度和频率特性要求较高的精密电路。
本型号为 0402(EIA)超小封装,典型外形尺寸约 1.0 mm × 0.5 mm,厚度小于 0.6 mm。采用卷带(Tape & Reel)包装,适配自动贴片生产线,利于大批量 SMT 生产与仓储管理。
C0G 陶瓷材料具有极低的温度漂移和介电老化,适合长期稳定运行。0402 体积小,需注意 PCB 布局与焊接工艺以避免机械应力导致晶片裂纹。推荐使用标准回流焊工艺(遵循元件供应商或 IPC 指南的温度曲线),焊接时避免过度加热和板弯曲;储存与运输请按干燥包装要求,防潮防震。
选型时请关注工作频率、环境温度范围与电压裕量;C0G 虽在温漂和频率响应上表现优异,但在需要大容量的场合可考虑其它介质。若需批量采购、可靠性认证(如 AEC‑Q200)或特殊包装要求,可与 HRE(芯声)技术支持联系获取更详细的样品与资料。
如需本型号的详细电性能曲线(频率响应、ESR/ESL、温度曲线)或推荐 PCB 封装图,请告知使用工况,我可为您提供更具体的技术支持与建议。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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