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HRE CSA0402X7R104K250GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402X7R104K250GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402X7R104K250GT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264495028
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402X7R104K250GT 产品概述
一、产品简介
CSA0402X7R104K250GT 是 HRE(芯声) 推出的贴片多层陶瓷电容（MLCC），额定容量 100 nF，公差 ±10%，额定电压 25 V，介质类型 X7R，封装 0402。该系列面向对体积、频率响应及成本有均衡要求的一般去耦、滤波和耦合场合。
二、主要特性
- 容值：100 nF (0.1 μF)，公差 ±10%
- 额定电压：25 V DC
- 介质：X7R（工作温度范围广，-55°C 至 +125°C，温度下限与上限间电容变化一般在 ±15% 范围）
- 封装：0402 表面贴装，适合高密度 PCB 布局
- 低 ESR/低 ESL，适合中高频去耦与滤波
- 稳定性：X7R 在温度与频率上比 Y5V 更稳定，但仍存在 DC 偏压依赖性，工作电压下容量可能下降，应在设计时考虑
三、典型应用
- 电源旁路与去耦（SMD 封装便于放置于 IC 引脚附近）
- 滤波与信号耦合（中低频至中高频段）
- 移动终端、可穿戴设备、工业控制、消费电子、通信设备等需要小体积电容的场合
四、PCB 布局与焊接建议
- 尽量将电容紧贴被去耦器件电源引脚，缩短回流路径以降低寄生电感。
- 使用短、宽的走线并通过多点接地或地铜盲/埋孔改善热与电性能。
- 0402 体积小，易受机械应力影响，避免靠板边或有弯折应力位置。
- 推荐采用无铅回流焊工艺，遵循 JEDEC/IPC 回流曲线（峰值温度 ≤ 260°C），并控制预热与冷却速度，减少热冲击。
五、可靠性与注意事项
- X7R 为介电型材料，存在温度漂移与 DC 偏压下容量衰减（实际工作电压越接近额定电压，衰减越明显）。在对稳定性要求高的场合可并联多只或选用更高介质/更大封装。
- 存储建议干燥、避光、常温条件下防潮保存；使用前若包装受潮，按厂方建议进行回流前烘烤处理。
- 具体漏电流、耐压、寿命与抗振动等参数以厂方数据表为准，批量采购前建议索取并验证样片数据。
六、包装与采购建议
产品通常以卷装（Tape & Reel）形式供货，适配贴片机贴装。订购或工程样片验证时，请确认完整料号 CSA0402X7R104K250GT、批次信息及 QA 报告，以便匹配生产与测试规范。
如需更详细的电气特性曲线（温度特性、频率响应、DC 偏压特性）、封装尺寸或回流焊建议曲线，我可以帮您整理并对比同类替代型号，便于选型与可靠性评估。
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