WMSIC Electronic Components

HRE CSA0603X7R103K500JT

ModelCSA0603X7R103K500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CSA0603X7R103K500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CSA0603X7R103K500JT
Electronic Component
1
Electronic Component
10nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495022
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSA0603X7R103K500JT 产品概述

一、产品简介

CSA0603X7R103K500JT 为 HRE(芯声) 系列贴片多层陶瓷电容(MLCC),标称容量 10nF(103),公差 ±10%(K),额定电压 50V,温度特性 X7R,封装 0603(1608公制)。该型号适用于要求体积小、稳定性中等的去耦、滤波和旁路电路,广泛应用于消费电子、通讯、工业控制等领域。

二、主要技术参数

  • 容值:10nF(0.01µF)
  • 精度:±10%(K)
  • 额定电压:50V DC
  • 温度特性:X7R(-55°C 至 +125°C,允许容量变化约 ±15%)
  • 封装:0603(1.6mm × 0.8mm)贴片
  • 封装形式:卷带包装(JT 表示常见的卷带包装形式)
  • 材料:多层陶瓷(典型介质为X7R类陶瓷)

三、产品特性与优势

  • 体积小、密度高:0603 封装适合高密度线路板,节省空间。
  • 温度稳定性适中:X7R 提供比Y5V更好的温度和电压稳定性,适合一般去耦与滤波用途。
  • 低等效串联电阻/电感(ESR/ESL):利于高频性能,能够有效抑制电源噪声。
  • 可靠性高、可批量生产:适配自动贴片与回流焊工艺,良率稳定。
  • RoHS/无铅制程(HRE 产品线常见合规性),满足环保与大多数应用标准。

四、典型应用场景

  • 电源去耦与旁路:微控制器、电源管理 IC 的输入/输出去耦。
  • 高频滤波:信号链路的交流耦合、RC 滤波网络。
  • 移动与便携设备:空间受限的消费类电子如手机、平板等。
  • 工业与通信设备:需要稳定电容但不极端温度稳定性的应用场合。

五、封装与安装建议

  • PCB 布局:电容尽量靠近被去耦 IC 的电源管脚,减少走线长度与回路面积。
  • 多颗并联:在高频去耦场合可与不同容量/封装电容并联,以覆盖更宽频率范围。
  • 焊接工艺:建议采用标准回流焊曲线,避免超温和长时间高温,防止裂纹。
  • 机械应力:贴片电容对基板机械应力敏感,过孔附近或受弯区域尽量避免放置或采用应力缓解设计。

六、可靠性与品质控制

HRE(芯声) 系列产品经过常规电气及可靠性测试,包括耐压测试、温度循环、湿热试验及机械冲击/震动等,以确保批次一致性。X7R 介质在温度与电压变化时会有一定容量漂移,设计时应考虑温漂和电压系数。

七、订购信息与注意事项

订购型号:CSA0603X7R103K500JT(请核对封装、容量、公差与额定电压)。包装形式通常为卷带(适配自动贴片机)。选型时请确认实际应用对温漂、偏压下容量保持和最大允许应力的要求;若用于高精度滤波或高温/高偏压环境,建议评估更高稳态等级或陶瓷以外的电容方案。若需样品、数据手册或可靠性报告,请联系供应商或 HRE 官方渠道获取完整资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.