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HRE CSA0402C0G150J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G150J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G150J500GT
- Electronic Component
- 1
- Electronic Component
- 15pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264743644
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G150J500GT 产品概述
一、产品简介
CSA0402C0G150J500GT 为 HRE(芯声) 推出的贴片多层陶瓷电容（MLCC），规格为 0402 封装，标称容值 15 pF，公差 ±5%（J），额定电压 50 V，温度特性为 C0G（Class 1）。该系列以尺寸小、温度稳定性高、介质损耗低著称，适合高频和精密电路中对容量稳定性要求较高的场合。
二、主要特性
- 容值：15 pF ±5%
- 额定电压：50 V DC
- 温度系数：C0G（0 ±30 ppm/°C，典型，具体请以厂方数据为准）
- 封装：0402（约 1.0 mm × 0.5 mm）
- 低介质损耗、低温漂、良好频率响应，适合高频信号路径与时钟、滤波、谐振回路使用。
- 符合环保要求（RoHS/REACH 等，请参照产品数据表）。
三、应用场景
- 高频射频前端、天线匹配网络与滤波器
- 时钟振荡器与谐振电路（对频率稳定性要求高）
- 精密模拟电路、采样保持与放大器的旁路/耦合
- 微处理器和高速信号线路的去耦与阻抗控制（对寄生误差敏感的场合）
四、封装与焊接建议
- 推荐在 PCB 上采用短走线、靠近器件引脚布置，以降低寄生电感与串联电阻。
- 焊接工艺建议遵循 IPC/JEDEC J-STD-020 无铅回流曲线，峰值温度与时间请参考厂方推荐曲线。
- 0402 尺寸器件抗机械应力能力有限，回流与波峰焊操作时避免强烈的热冲击与机械弯曲。
五、可靠性与存储
- C0G 型 MLCC 在温度与电压条件下具有优良的容量稳定性与低漏振特性，但仍需注意机械应力（挤压、弯曲）可能导致裂纹或失效。
- 存储建议置于干燥、常温环境，密封包装未开封前应避免潮湿与强光直射；开封后应在规定时间内完成贴片作业，必要时回流前进行烘烤以去除吸潮。
六、订购与包装
- 零件号含义：CSA0402C0G150J500GT 表示 CSA 系列、0402 封装、C0G 温度特性、15pF、J（±5%）、50V、GT（常用于卷带包装/工厂代码）。
- 具体包装数量（卷带盘数）及交期、放样信息请联系 HRE(芯声) 正式渠道或代理商获取最新资料与认证样片。
本产品以高稳定性与低损耗为核心优势，适合对频率响应与容量漂移敏感的设计。选型时建议结合工作频率、温度范围与 PCB 布局进行验证，必要时参考厂方完整数据手册与性能曲线进行仿真与评估。
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