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HRE CGA0402C0GR30B500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- HRE CGA0402C0GR30B500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402C0GR30B500GT
- Electronic Component
- 1
- Electronic Component
- 0.3pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0265109125
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402C0GR30B500GT 产品概述
一、主要参数
- 品牌：HRE（芯声）
- 型号：CGA0402C0GR30B500GT
- 容值：0.3 pF
- 容值精度：±0.1 pF
- 额定电压：50 V
- 温度系数/材质：C0G（COG，近零温漂）
- 封装：0402（公制：1005）
二、产品特点
该型号为超小型高稳定电容，容值极低且容差窄，适用于对电容精度和温漂要求极高的场合。C0G介质带来近似零的温度系数与极低的介质损耗，频率特性优秀，寄生电感与损耗最低，适合高频、射频电路使用。0402小封装有利于高密度贴片组装与体积受限的终端产品。
三、典型应用场景
- 射频及微波匹配网络、阻抗调节与滤波器元件
- 高频振荡器、谐振回路与时钟电路的耦合/定容
- 天线匹配、电路调试中的微调电容
- 精密仪表与测试设备中对温度稳定性要求高的场景
四、封装与装配建议
产品为0402贴片，通常以卷带（Tape & Reel）形式供货，适配自动贴片生产线。焊接建议采用推荐的回流曲线，缩短焊盘与焊点的引线长度以降低寄生效应。板级布局应尽量缩短信号走线与避免不必要的旁路环路，必要时靠近地平面布置以改善屏蔽与回流路径。
五、可靠性与选型要点
C0G材质在温度与频率变化下性能稳定，适合长期稳定性要求高的设计。选型时注意实际电路中的有效电压、谐振频率及电压系数（VCC）影响；超低容值在PCB走线与焊盘寄生电容占比较大，布局时需一并评估。HRE（芯声）品牌产品一般经过严格品质控制，适合量产应用，如需具体环境测试标准与寿命数据，请参阅厂方数据手册或联系供应商获取详细认证资料。
如需进一步的电气特性曲线、回流焊工艺参数或样品支持，我可协助整理或联系供应渠道。
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