WMSIC Electronic Components

HRE CGA0402C0G1R5C500GT

ModelCGA0402C0G1R5C500GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

17 specifications

Core information

Product name
HRE CGA0402C0G1R5C500GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402C0G1R5C500GT
Electronic Component
1
Electronic Component
1.5pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0265156234
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402C0G1R5C500GT多层陶瓷电容(MLCC)产品概述

一、产品定位与基本属性

CGA0402C0G1R5C500GT是HRE(芯声)电子推出的高频高稳定多层陶瓷电容(MLCC),属于C0G(国际标准对应NP0)温度系数系列。该产品针对小尺寸、低损耗、宽温稳定的应用场景设计,兼顾高可靠性与紧凑封装,适配消费电子、通信、医疗等领域的高频信号处理需求,是替代传统小容值电容的优选方案。

二、关键电气性能参数

  1. 容值与精度:标称容值1.5pF(型号中“1R5”为容值标识),C0G类电容典型容差为±0.25pF或±1%(依厂家规格),批量生产一致性优异,无需额外筛选;
  2. 额定电压:直流(DC)额定电压50V,工作温度范围内可稳定承受该电压,无击穿或漏电流超标风险;
  3. 损耗特性:损耗角正切(tanδ)≤0.0001(即0.01%),高频下能量损耗极低,适合射频信号传输与滤波;
  4. 绝缘性能:常温(25℃)下绝缘电阻≥10¹⁰Ω,125℃高温环境下仍保持≥10⁹Ω,绝缘可靠性突出。

三、封装与物理特性

  1. 封装规格:采用0402英制表面贴装封装,对应公制尺寸为1.0mm×0.5mm(长×宽),厚度(含电极)约0.5±0.1mm,体积紧凑,可大幅节省PCB布局空间,适配高密度集成设计;
  2. 电极结构:端电极采用“银层+镍层+锡层”三层复合结构,兼容性好,适配回流焊、波峰焊等常规贴装工艺,焊接后剪切强度≥2N,可靠性高;
  3. 材质特性:介质层为C0G类钛酸钡基陶瓷材料,电极层为银钯合金,耐温性(-55℃~125℃)与化学稳定性优异,无铅环保。

四、温度特性与稳定性

C0G(NP0)是MLCC中温度稳定性最优的系列之一,该产品核心特性:

  1. 温度系数:≤±30ppm/℃,在-55℃至125℃宽温范围内,容值变化量极小(≤0.003%/℃),几乎不受环境温度影响;
  2. 频率特性:在1GHz以上高频频段仍保持容值稳定,无明显谐振偏移,适合射频、微波电路的信号匹配与滤波;
  3. 老化特性:几乎无容值老化现象(老化率≤0.1%/decade),长期使用(≥10年)容值变化可忽略,满足设备生命周期需求。

五、典型应用场景

该电容因小尺寸、低损耗、高稳定的特性,广泛应用于:

  1. 通信领域:蓝牙/WiFi 6模块、5G基站射频前端、卫星通信设备的信号滤波与耦合;
  2. 消费电子:高端智能手机、平板电脑的射频天线匹配、时钟电路振荡回路;
  3. 医疗电子:便携式监护仪、超声设备的高频信号处理,符合医疗设备对稳定性的严苛要求;
  4. 工业控制:工业物联网(IIoT)终端的传感器信号滤波,适应工业环境宽温(-40℃~85℃)变化。

六、品牌与可靠性保障

HRE(芯声)作为国内专业MLCC制造商,该产品具备可靠的品质保障:

  1. 认证资质:通过ISO9001质量管理体系、ISO14001环境管理体系认证,符合RoHS 2.0、REACH SVHC环保指令;
  2. 可靠性测试:经过高温存储(125℃×1000h)、温度循环(-55℃~125℃×1000次)、湿度负荷(85℃/85%RH×1000h)等严苛测试,不良率≤0.1%;
  3. 一致性:批量生产中容值、尺寸偏差控制在±5%以内,降低PCB设计与生产的调试成本。

该产品凭借优异的高频性能与宽温稳定性,成为众多高端电子设备高频模块的核心组件,可有效提升电路信号质量与设备可靠性。

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