WMSIC Electronic Components

HRE CGA0402X5R224K100GT

ModelCGA0402X5R224K100GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0402X5R224K100GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402X5R224K100GT
Electronic Component
1
Electronic Component
220nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0264743634
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402X5R224K100GT 贴片多层陶瓷电容(MLCC)产品概述

一、产品核心参数

CGA0402X5R224K100GT是HRE(芯声)品牌针对低压小型化电路设计的0402封装贴片MLCC,核心参数精准匹配消费电子、物联网等领域需求:

  • 容值与精度:220nF(代码“224”,即22×10⁴pF),精度±10%(标识“K”),满足常规滤波、耦合的参数一致性要求;
  • 电压与温度特性:额定工作电压10V(标识“100”),温度系数为X5R(-55℃~+85℃范围内容值变化±15%);
  • 封装规格:0402英寸封装(公制1005),尺寸紧凑适配小型化设计。

型号标识逻辑清晰:“CGA”为MLCC系列代号,“0402”对应封装尺寸,“X5R”定义温度稳定性,“224K”明确容值精度,“100”为额定电压,“GT”为工艺/批次补充标识。

二、性能特点

  1. 宽温稳定特性:X5R温度系数使电容在-55℃至+85℃范围内,容值偏差控制在±15%以内,无需额外温度补偿电路,适配手机、智能穿戴等高低温使用场景;
  2. 小型化适配:0402封装体积仅1.0mm×0.5mm×0.5mm,可显著降低电路整体尺寸,满足便携设备“轻薄化”需求;
  3. 低损耗高效能:多层陶瓷介质与金属电极叠层结构,具备低等效串联电阻(ESR)、低等效串联电感(ESL)特性,提升电源滤波、信号耦合效率,减少能量损耗;
  4. 批量一致性优异:HRE芯声采用标准化生产工艺,批次间容值、精度偏差极小,适合工业级批量生产,降低电路调试成本。

三、典型应用场景

该型号电容因低压、小体积、稳定特性,广泛覆盖以下领域:

  1. 消费电子便携设备:智能手机、平板电脑、智能手表的电源滤波(电池回路、DC-DC输出)、音频信号耦合电路,适配低功耗与空间限制;
  2. 物联网终端:智能家居传感器(温湿度、运动传感器)、智能插座、蓝牙/Wi-Fi模块的稳压与噪声抑制,满足低电压工作环境;
  3. 小型家电与数码配件:遥控器、耳机充电盒、移动电源的控制电路,实现电源噪声过滤与信号稳定;
  4. 工业低功耗模块:小型PLC辅助电源、传感器节点信号调理电路,适配宽温度范围与低电压需求。

四、可靠性与质量保障

  1. 环保与认证:符合RoHS 2.0、REACH标准,无铅无镉,通过IEC 60384-14、JIS C 5102国际电子元件标准测试,可全球市场准入;
  2. 严苛质量管控:每批次产品全参数检测(容值、精度、耐压、ESR),高低温循环(-55℃~+85℃,1000次)、湿度老化(85℃/85%RH,1000小时)均满足工业级要求;
  3. 长寿命预期:额定电压(10V)、室温(25℃)下寿命达10⁶小时以上,可覆盖大多数电子设备使用周期。

五、封装与焊接注意事项

  1. 尺寸规范:公制尺寸1.0±0.1mm(长)×0.5±0.1mm(宽)×0.5±0.1mm(厚),电极宽度0.2mm,适配常规贴片焊接设备;
  2. 焊接参数:回流焊峰值温度235℃245℃(时间3060秒),波峰焊温度240℃250℃,避免过热导致陶瓷开裂;PCB焊盘建议长0.81.0mm、宽0.3~0.4mm;
  3. 存储条件:未开封产品存储于-40℃~+60℃、湿度≤60%RH环境,开封后3个月内使用完毕,防止电极氧化影响焊接性能。

该型号电容凭借“小体积、宽温稳定、高性价比”优势,成为消费电子与物联网领域低压电路的主流选型之一。

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