WMSIC Electronic Components

HRE CGA0402C0G271J500GT

ModelCGA0402C0G271J500GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0402C0G271J500GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402C0G271J500GT
Electronic Component
1
Electronic Component
270pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0264596055
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402C0G271J500GT多层陶瓷电容产品概述

一、产品基础信息与型号解读

型号:CGA0402C0G271J500GT
品牌:HRE(芯声)
封装:0402(英制,对应公制1005,尺寸1.0mm×0.5mm)

型号各部分含义拆解:

  • CGA:多层陶瓷电容(MLCC)的通用标识前缀;
  • 0402:封装尺寸(0.04英寸×0.02英寸);
  • C0G:温度系数(与NP0等效,低损耗高稳定);
  • 271:容值编码(27×10¹=270pF);
  • J:容值精度(±5%);
  • 500:直流额定电压50V;
  • GT:HRE内部生产工艺/封装后缀(无特殊用户定制含义)。

二、核心参数与性能特点

2.1 温度稳定性(C0G核心优势)

C0G属于低损耗、宽温稳定型陶瓷电容,温度系数≤±30ppm/℃,在-55℃~125℃范围内,容值变化率≤±0.3%——这是其区别于X7R(±15%)、Y5V(±82%)等温度敏感型电容的关键,直接决定了高频电路的频率精度。

2.2 容值与精度

标称容值270pF,精度±5%(J档),批量生产一致性优于标称(实际偏差多控制在±3%以内),无需额外校准即可稳定匹配电路需求。

2.3 电压与可靠性

直流额定电压50V,符合RoHS2.0环保标准;通过高温负载寿命测试(125℃、50V直流下,1000小时容值变化≤±2%,损耗角正切≤0.001),长期工作可靠性达标。

2.4 封装与适配性

0402小封装适配高密度PCB设计(如智能手机主板、智能穿戴模块),焊接兼容性好(回流焊温度范围220℃~260℃),支持自动化贴片生产,适合批量组装。

三、典型应用场景

结合参数优势,该电容主要用于以下场景:

3.1 射频(RF)与无线通信模块

  • 蓝牙5.0/WiFi 6模块:C0G低损耗(tanδ≤0.0005 at 1MHz)减少信号衰减,稳定容值保证晶振匹配精度;
  • 5G sub-6GHz前端电路:适配射频滤波、阻抗匹配需求,避免温度变化导致的信号相位偏移。

3.2 智能终端产品

  • 智能手机:射频天线匹配、WiFi模块滤波;
  • TWS耳机:蓝牙接收电路、充电管理滤波;
  • 平板/智能手表:无线连接模块的关键匹配电容。

3.3 工业控制与仪器仪表

  • 高精度传感器信号调理:宽温范围内容值稳定,避免环境温度变化导致的测量误差;
  • PLC模拟量输入模块:滤波电容提升信号抗干扰能力。

3.4 汽车电子辅助电路

  • 车载信息娱乐系统蓝牙模块:适配-40℃~85℃车载环境;
  • 倒车雷达信号滤波:低损耗保证信号清晰度(非安全级应用,需确认整车级认证需求)。

四、选型与使用注意事项

  1. 电压降额:建议直流工作电压不超过40V(80%降额),交流/脉冲电压需进一步降额(峰值≤30V);
  2. 温度范围:避免长期工作在125℃以上,低温端不低于-55℃;
  3. 焊接工艺:0402封装需匹配PCB焊盘(建议0.6mm×0.3mm),回流焊控制升温速率(≤3℃/s),避免虚焊/桥接;
  4. 振荡电路匹配:若用于晶振振荡,需确认并联/串联容值组合(如与12MHz晶振匹配时,容值偏差直接影响频率精度)。

五、品牌优势

HRE(芯声)是国内专注MLCC研发的品牌,该型号采用自主陶瓷配方,一致性优于进口同类产品(如村田GRM1555C1H271JA02D),交期稳定(常规715天),性价比提升15%20%,适合中高端消费电子与工业级应用。

该电容以“小体积+高稳定+低损耗”为核心竞争力,覆盖无线通信、智能终端等主流场景,是替代进口的高性价比选择。

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