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HRE CGA0603X5R106M350JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X5R106M350JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X5R106M350JT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495337
- Electronic Component
- X5R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X5R106M350JT 多层陶瓷贴片电容（MLCC）产品概述
一、产品核心参数与型号解读
CGA0603X5R106M350JT是HRE芯声推出的高性能多层陶瓷贴片电容（MLCC），型号各部分对应明确：
- CGA：芯声MLCC系列专属前缀；
- 0603：英制封装尺寸（对应公制1608，即1.6mm×0.8mm）；
- X5R：温度特性（工作温度-55℃~+85℃，容值变化≤±15%）；
- 106：容值编码（10×10⁶ pF=10μF）；
- M：精度标识（±20%）；
- 350：额定直流电压（35V）；
- JT：封装工艺细化标识（兼容无铅回流焊）。
核心参数汇总：
参数项 具体规格 容值 10μF ±20% 额定电压 35V DC 温度系数 X5R（-55℃~+85℃，容差±15%） 封装 0603（1.6mm×0.8mm×0.5mm典型厚度） 端电极 Ni/Sn无铅镀层 工作温度范围 -55℃~+85℃二、性能特点
该产品针对小型化电子设备优化，核心性能优势突出：
- 小体积高密度：0603封装适配手机、智能穿戴等紧凑设备，支持高密度贴装，可有效缩小产品尺寸；
- 稳定温度特性：X5R温度系数使容值在工作温度范围内波动可控，避免因温度变化导致电路性能偏移；
- 高可靠性抗干扰：多层陶瓷无引线结构，抗振动、冲击性能优异（通过2g加速度振动测试）；低ESR/ESL特性适合高频电路滤波，减少信号损耗；
- 宽电压适配：35V额定电压覆盖低压电源、信号耦合等场景，避免过压击穿风险；
- 工艺兼容性强：Ni/Sn无铅端电极兼容无铅回流焊（峰值温度260℃），焊接可靠性高，符合环保要求。
三、典型应用场景
CGA0603X5R106M350JT广泛应用于以下领域：
- 消费电子：智能手机/平板的电池供电电路去耦、音频耦合、射频信号匹配；智能手表/手环的传感器信号滤波；
- 小型家电与智能家居：遥控器、智能插座、扫地机器人的控制电路滤波；加湿器、台灯的电源稳压；
- 工业控制：小型传感器模块（温度/压力传感器）的信号耦合；小型PLC（可编程逻辑控制器）的电源去耦；
- 汽车电子辅助系统：车载导航、行车记录仪的电源滤波（舱内环境温度符合X5R要求）；胎压监测模块的信号处理。
四、可靠性与品质保障
该产品通过多重可靠性测试，符合行业标准：
- 高温寿命测试：125℃、额定电压下工作1000小时，容值变化≤±10%，损耗角正切变化≤±20%；
- 湿度循环测试：-40℃~+85℃、90%RH循环100次，性能无衰减；
- 振动测试：10~2000Hz频率、2g加速度持续2小时，无开路/短路；
- 环保认证：符合RoHS 2.0（无铅、无镉）、REACH（SVHC合规），通过ISO 9001质量管理体系认证。
五、品牌与供货说明
HRE芯声是国内专注MLCC研发生产的高新技术企业，产品覆盖0402~1210全系列封装，供货稳定（月产能超10亿只），可满足批量生产需求；针对客户定制化需求（如特殊容值、电压），支持快速响应。
该产品平衡了性能、成本与可靠性，是小型化电子设备电源滤波、信号耦合的高性价比选择。
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