WMSIC Electronic Components

HRE CGA0402X7R472K500GT

ModelCGA0402X7R472K500GT
Package0402
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0402X7R472K500GT
Type
HRE
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0402X7R472K500GT
Electronic Component
1
Electronic Component
4.7nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
10
Electronic Component
BM0264495107
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0402X7R472K500GT 产品概述

一、产品概览

CGA0402X7R472K500GT 是 HRE(芯声)提供的一款高密度片式多层陶瓷电容(MLCC),额定电容 4.7nF(472)、公差 ±10%(K)、额定电压 50V、介质材料为 X7R,封装为 0402(1.0 × 0.5 mm)。该型号面向对体积、可靠性和成本有严格要求的表面贴装电路,适合大批量自动化贴装与回流焊工艺。

二、主要参数

  • 容值:4.7 nF(472 编码)
  • 精度:±10%(K)
  • 额定电压:50 V DC
  • 介质:X7R(-55°C 至 +125°C,温度下电容变化限值通常在 ±15%)
  • 封装:0402(外形约 1.0 × 0.5 mm)
  • 品牌:HRE(芯声)
  • 封装/卷带:GT(卷带供料,适合贴片机)

三、特性与优势

  • 小尺寸:0402 封装利于高密度布板和小型化产品设计,节省 PCB 面积。
  • 温度稳定性:X7R 提供在宽温度范围内的稳定电容特性,适合常用的去耦与旁路场景。
  • 电压耐受:50V 额定适用于中等电压电源线路与模拟前端电路。
  • 可回流焊兼容:适配常见 SMT 组装流程,支持自动化高产能生产。
  • 成本与可得性:MLCC 典型的成本优势,适合批量应用。

四、典型应用场景

  • 电源去耦与旁路:用于稳压器输入/输出和数字电路的瞬态抑制。
  • 滤波与耦合:模拟前端、信号链滤波器、DC-DC 转换器输入输出滤波。
  • 时序与延时网络:在对温漂要求不高的 RC 网络中可作为电容元件。
  • 工业与消费电子:通讯设备、仪表、便携设备等中等电压模块。

五、选型与使用注意事项

  • 直流偏置效应:X7R 高频介质在施加直流电压时电容会下降,实际工作电容可能低于标称值,设计时需考虑该效应。
  • 温度系数:X7R 在 -55°C 至 +125°C 范围内电容会有一定变化(通常 ±15%),不适用于要求极高温稳定性的时基元件。
  • 电压降额建议:为降低偏置和可靠性风险,建议在设计中采用一定降额(经验值常在额定电压的 50%~80% 之间,根据应用严格性调整)。
  • 机械应力:0402 体积小且陶瓷脆弱,焊接、修板及 PCB 弯曲时应避免过大机械应力。
  • 焊接工艺:遵循制造商推荐回流曲线,避免过度热冲击及快速冷却。

六、包装与可靠性

CGA0402X7R472K500GT 常以卷带(GT)形式供货,适配贴片机直接上料,利于量产。HRE(芯声)在制造与质量控制上通常遵守 RoHS 要求并进行 100% 电气测试或抽检(具体检验等级及认证请参照厂家数据手册),可提供可靠性验证和批次追溯。

七、总结

该型号以小型化封装、适中的电压等级与经济的 X7R 介质,满足现代电子产品对去耦、滤波和通用电容的需求。设计时应关注直流偏置与温度特性,根据电路要求合理选型与降额使用,配合良好的焊接与处理工艺,可在消费电子、工业控制、通信设备等领域实现稳定可靠的应用。若需更详细的等效电路参数、ESR/ESL、温度曲线或样品测试结果,建议索取 HRE(芯声)官方产品规格书。

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