WMSIC Electronic Components

HRE CGA0201C0G680J500ET

ModelCGA0201C0G680J500ET
Package0201
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0201C0G680J500ET
Type
0201
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0201C0G680J500ET
Electronic Component
1
Electronic Component
68pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
50
Electronic Component
BM0264778629
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0201C0G680J500ET 多层陶瓷电容(MLCC)产品概述

一、产品核心身份与基本定位

CGA0201C0G680J500ET是芯声电子(HRE) 推出的0201封装C0G类多层陶瓷电容(MLCC),属于低容值、高稳定性高频应用的基础元件。型号命名遵循行业通用规则,各段含义清晰:

  • CGA:芯片级陶瓷电容封装标识;
  • 0201:英制封装尺寸(0.02英寸×0.01英寸,约0.508mm×0.254mm);
  • C0G:温度系数代号(对应国际标准NP0,温度特性极稳定);
  • 680:容值编码(前两位68,第三位0代表×10⁰,即68pF);
  • J:精度等级(±5%);
  • 500:额定电压(50V DC);
  • ET:HRE内部工艺/批次标识。

该产品定位于消费电子、通信、工业控制等领域的高频滤波、信号耦合、电源去耦场景,兼顾小体积与高稳定性,是替代传统电解电容、薄膜电容的高性价比选择。

二、关键性能参数深度解析

1. 温度稳定性(C0G核心优势)

C0G类电容的温度系数为0±30ppm/℃,是所有陶瓷电容中温度特性最稳定的类型。在-55℃至125℃的宽温范围内,容值变化率不超过±0.3%(以68pF为例,变化量≤0.204pF),可避免因温度波动导致的电路参数漂移,尤其适合射频、时钟等对频率精度敏感的电路。

2. 容值与精度

容值为68pF,属于中等低容值范围,适配高频信号的传输与滤波需求;精度±5%(J级),满足大多数民用、工业级电路的精度要求,无需额外校准即可稳定工作。

3. 额定电压与安全裕量

额定电压50V DC,覆盖3.3V、5V、12V、24V等主流电源系统,且留有20%左右安全裕量(实际工作电压建议不超过40V),可降低长期老化风险。

4. 高频特性

等效串联电阻(ESR)典型值<10mΩ@100MHz,等效串联电感(ESL)<0.5nH,适合10MHz以上高频应用,能有效抑制射频干扰,提升电路信噪比。

三、典型应用场景匹配

1. 消费电子

  • 智能手机/平板:射频前端滤波(WiFi、蓝牙模块)、触控屏信号耦合、电池管理系统(BMS)电源去耦;
  • 笔记本电脑:主板时钟电路滤波、USB接口EMI抑制。

2. 通信设备

  • 基站射频模块:天线匹配网络、收发器滤波;
  • 路由器/交换机:以太网接口EMI滤波、时钟同步电路。

3. 工业控制

  • 传感器节点:模拟信号滤波(温度、压力传感器)、电源噪声抑制;
  • PLC模块:数字信号隔离耦合、电源去耦。

4. 汽车电子(辅助级)

  • 车载信息娱乐系统:蓝牙模块滤波、USB接口EMI抑制(部分批次通过AEC-Q200认证,可覆盖汽车舱内环境)。

四、封装与可靠性优势

1. 小体积高密度

0201封装尺寸仅0.508mm×0.254mm,厚度约0.2mm,可显著减少PCB占用面积,适配便携式设备、高密度服务器主板等对空间要求严格的场景。

2. 高可靠性

  • 无极性设计:无需区分正负极,安装便捷且降低错装风险;
  • 宽温耐受:工作温度-55℃~125℃,适应工业高温、汽车舱内等极端环境;
  • 抗振动性能:多层陶瓷结构机械强度高,可承受10g~20g振动加速度,符合GJB军工标准;
  • 长寿命:额定工况下平均寿命达10⁶小时以上(约114年),远超电解电容。

3. 环保合规

符合RoHS 2.0、REACH SVHC等国际环保标准,不含铅、镉、汞等有害物质,适配全球市场需求。

五、品牌背书与质量保障

芯声电子(HRE)是国内专注MLCC研发生产的高新技术企业,拥有10余年制造经验,产品覆盖01005至1812全系列封装、C0G/X7R/Y5V全温度系数类型。

CGA0201C0G680J500ET通过以下质量认证:

  • 工业级:符合GB/T 2693-2001(电子元器件用陶瓷介质多层电容器);
  • 汽车级(部分批次):通过AEC-Q200可靠性标准;
  • 供货稳定:自动化生产线月产能超10亿颗,可满足批量订单需求。

该产品以小体积、高稳定性、宽温特性为核心优势,适配多领域高频电路需求,是电子设计中提升电路性能与可靠性的理想选择。

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