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HRE CSA0402C0G200J500GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0402C0G200J500GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0402C0G200J500GT
- Electronic Component
- 1
- Electronic Component
- 20pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264495043
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0402C0G200J500GT 产品概述
一、产品简介
CSA0402C0G200J500GT 为 HRE(芯声) 出品的多层陶瓷贴片电容（MLCC），标称容值 20 pF，容差 ±5%（J），额定电压 50 V，温度系数 C0G（亦称 NP0），封装尺寸 0402（1.0 × 0.5 mm 级）。C0G/NP0 材料具有优良的温度稳定性与低损耗特性，适合对频率与时间基准敏感的电路使用。
二、主要性能与规格
- 容值：20 pF
- 容差：±5%（J）
- 额定电压：50 V DC
- 温度系数：C0G（-55°C 至 +125°C 范围内几乎无漂移）
- 封装：0402（小型化，适合高密度贴装）
- 特性：低介质损耗、高 Q 值、良好绝缘电阻与长期稳定性
- 环保标准：符合 RoHS 无铅要求
三、典型应用场景
- 高频滤波、射频匹配网络与微带线电路
- 振荡器、时钟和谐振电路中的基准元件
- ADC/DAC、采样保持电路与高精度模拟电路的旁路与耦合
- 精密计时、传感器接口与通信设备中需稳定电容的场合
四、装配与焊接建议
- 推荐采用卷带供料（Tape & Reel）配合自动贴片机进行贴装。
- 回流焊工艺应遵循厂方或 IPC/JEDEC 无铅回流规范，峰值温度建议 ≤ 260°C 且保温时间及升降温速率按制程要求控制，避免过热或长时间高温暴露。
- 贴片时避免对封装施加过大机械压力或在焊接前对电容进行弯曲，应使用合适的吸嘴和取放参数以防损伤。
五、储存与可靠性
- 建议密封干燥保存，避免潮气和强腐蚀环境，长期储存时遵循元器件的防潮包装及回流前干燥烘烤要求。
- C0G 材料在温度和电压下表现稳定，适合对电容漂移和损耗敏感的长期可靠性设计；如需用于极端温度或特殊应力环境，请做专项可靠性评估。
六、订购信息与注意事项
- 型号：CSA0402C0G200J500GT；品牌：HRE(芯声)；封装：0402。
- 常用包装形式为卷带（Tape & Reel），便于 SMT 自动化装配。
- 选型时请注意电压裕度、寄生电感/电阻对高频性能的影响，以及在电路板布局中的旁路/耦合位置优化。
如需更详细的电气参数（如耐压测试、绝缘电阻、介质损耗角正切 tanδ）或回流曲线和可靠性测试报告，请联系供应商获取完整数据手册。
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