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HRE CGA0603X7R221K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R221K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R221K500JT
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495121
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R221K500JT 产品概述
一、产品概况
CGA0603X7R221K500JT 是 HRE(芯声) 系列片式多层陶瓷电容（MLCC），标称电容 220 pF，公差 ±10%，额定电压 50 V，介质材料为 X7R，封装为 0603（1608 公制）。此器件面向对体积、频率响应、温度稳定性有平衡要求的中高频电子电路，兼顾耐压与小型化布局需求。
二、主要特性
- 电容值：220 pF（标称）
- 公差：±10%（制造公差）
- 额定电压：50 V DC
- 温度特性：X7R（工作温度范围 -55°C ~ +125°C，温度引起的容量变化在典型条件下受控）
- 封装：0603（适合高密度 PCB 布局）
- 品牌：HRE(芯声)
三、电气与温度行为说明
X7R 为温度稳定型陶瓷介质，适于一般电子电路的旁路、耦合与滤波应用。需注意两点：一是 X7R 的容量随温度在规范范围内有变化（典型允许范围 ±15%）；二是在高电场（接近额定电压）下存在直流偏置效应，容量会出现一定下降。对于 220 pF 容值，这种 DC bias 影响相对较小，但在精密或高压条件下仍建议验证实际电路响应。
四、典型应用场景
- 高频旁路与去耦（射频前端、时钟、放大器供电去耦）
- 谐振回路与匹配网络（RF 匹配、滤波器）
- 耦合/隔直电容（在不要求极低泄漏的信号链路）
- 空间受限的消费类和工业电子产品（手机、可穿戴、仪表、通信模块等）
五、封装与焊接建议
0603 小尺寸利于高密度布局，但对焊接与机械应力敏感。建议：
- 参考厂商推荐的焊盘尺寸与贴装公差，保证良好焊点形成；
- 采用推荐的回流焊曲线（符合 J-STD-020），避免超过规定的峰值温度与保温时间；
- 避免板弯曲或在焊接后施加较大机械应力；对可能受应力的位置可增加阻焊或开孔减压设计。
六、可靠性、检验与选型建议
- 常规出厂测试应包含电容值、介质损耗（DF）、绝缘电阻与耐压测试；关键应用可要求额外的温循环、湿热与机械冲击试验报告。
- 在关键或长寿命设计中，可考虑电压降额使用（例如留有裕量，避免长期在额定电压下工作）以提高可靠性并减小 DC bias 影响。
- 存储与领料按厂商包装说明保存，避免潮湿环境；如包装指示需烘烤再流焊，应按 MSL 要求处理。
七、型号编码速查（通用说明）
型号中常见的信息：CGA0603 指封装/系列，X7R 表示介质，221 表示电容值（220 pF），K 表示 ±10% 公差，500 与后缀常用于表示额定电压与包装/端接形式。具体编码含义请以 HRE(芯声) 官方数据手册为准。
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