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HRE CSA0603X5R105K250JT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603X5R105K250JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603X5R105K250JT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264778597
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0603X5R105K250JT 产品概述
一、产品简介
CSA0603X5R105K250JT 为 HRE(芯声) 出品的贴片多层陶瓷电容（MLCC），尺寸 0603（1608公制），标称容量 1µF，初始容差 ±10%，额定电压 25V，介质材料 X5R。该系列以小型化、高容量密度为特点，适用于对面积受限但需中等温度稳定性的电子产品。
二、主要特性
- 尺寸：0603（1.6mm × 0.8mm 级别）
- 容量：1µF（105）
- 公差：±10%（K）
- 额定电压：25V
- 介质：X5R（工作温度范围与容值变化属介质特性）
- 封装形式：贴片（适配自动贴片、回流焊工艺）
- 品牌：HRE（芯声）
三、性能与注意事项
X5R 为二类介质，具有较高的体积电容密度，但在温度、偏压下容值会有变化；尤其在接近额定电压时存在明显的直流偏压效应，会导致实际有效容值下降。设计时建议留有裕度：对关键去耦或储能场合，可考虑增大额定电压或并联冗余电容以保证系统稳定。
四、典型应用
- 电源去耦与旁路（微处理器、模拟电路）
- 滤波电路与去耦网络（消费电子、通讯设备）
- 移动设备与便携式终端（受限空间的电容布局）
- 一般电子产品的旁路、耦合应用
五、封装与可靠性建议
该型号常见为卷盘包装（Tape & Reel），兼容常见自动贴装流程。推荐遵循厂商回流焊温度曲线与存储/回流前干燥要求，避免潮湿导致焊接缺陷。关键设计应考虑温度循环与机械应力，0603小尺寸在振动或冲击下需注意焊点强度与基板材料匹配。
六、选型提示
若系统对容值稳定性、温度系数或偏压依赖性敏感，建议权衡 X5R 的性价比与更稳定的介质（如 C0G/NP0）或选择更高额定电压的同类器件；同时参考 HRE 提供的容值随偏压和温度变化的曲线图，以完成精确电路仿真与裕度设计。
如需样品、datasheet 或库存与包装信息，可联系供应商获取完整技术资料。
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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