WMSIC Electronic Components

HRE CGA0603X5R475K350JT

ModelCGA0603X5R475K350JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603X5R475K350JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603X5R475K350JT
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495103
Electronic Component
X5R
Voltage
35V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603X5R475K350JT 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本定位与型号解析

CGA0603X5R475K350JT是HRE芯声推出的通用型多层陶瓷贴片电容(MLCC),专为中低压电子电路的滤波、耦合、旁路等核心功能设计。其型号各部分含义清晰:

  • CGA:多层陶瓷电容系列标识;
  • 0603:封装尺寸(英制代码,对应公制1.6mm×0.8mm);
  • X5R:温度特性介质代码;
  • 475:容值编码(47×10⁵pF=4.7μF);
  • K:精度等级(±10%);
  • 350:额定直流电压(35V);
  • JT:产品工艺/批次后缀(参考官方 datasheet)。

该产品定位为“高性价比通用MLCC”,兼顾性能、体积与成本,适配大多数民用、工业级电子设备的常规电路需求。

二、核心性能参数详解

作为X5R介质MLCC,该产品核心性能满足多场景应用:

2.1 容值与精度

标称容值4.7μF,精度±10%(K级),覆盖电源滤波“储能-放电”、信号耦合“阻抗匹配”等通用需求,无需额外容值补偿。

2.2 电压特性

额定直流电压35V,远高于5V/12V/24V低压系统工作电压,留有充足安全裕量;交流耐压符合IEC标准,适配AC-DC转换电路滤波。

2.3 温度稳定性

采用X5R介质,工作温度范围-55℃~+85℃,容值变化率±15%(相对25℃),宽温环境下(如车载、户外工业)仍保持稳定,避免电路参数漂移。

2.4 其他关键性能

  • 绝缘电阻≥10⁹Ω(25℃,10V DC),漏电流极低;
  • 损耗因数≤5%(1kHz,25℃),中低频滤波无明显能量损耗;
  • 无极性设计,贴装与电路设计更简便。

三、适用典型应用场景

因体积小、性能稳定,广泛应用于以下领域:

3.1 消费电子

  • 手机/平板的PMIC电源滤波;
  • 蓝牙耳机/智能手表的信号耦合;
  • 便携式音箱/充电器的AC-DC滤波。

3.2 工业控制

  • PLC的I/O接口滤波;
  • 传感器节点(温度/压力)的信号调理;
  • 小型工业电源输出滤波。

3.3 通信设备

  • 路由器/交换机的电源模块滤波;
  • 4G/5G基站射频前端辅助电路;
  • 光纤收发器的信号耦合。

3.4 汽车电子(低压场景)

  • 车载中控屏电源滤波;
  • 倒车雷达/记录仪的信号处理;
  • 汽车音响音频耦合(部分批次支持IATF16949)。

四、封装与可靠性设计

4.1 封装适配性

0603封装(1.6mm×0.8mm)符合SMT标准,适配自动化贴片机高速生产,厚度约0.8mm,节省PCB空间,适合高密度集成设备。

4.2 可靠性优势

  • 多层陶瓷结构:无电解液干涸风险,寿命远长于电解电容;
  • 耐振动冲击:可承受10g~20g振动(参考datasheet),适配移动/工业振动环境;
  • 环保合规:符合RoHS 2.0、REACH,无铅无镉,满足绿色制造要求。

五、品牌与质量保障

HRE芯声作为国内MLCC专业制造商,拥有10余年行业经验,产品通过:

  • ISO 9001质量管理体系;
  • IATF 16949汽车行业认证(部分产品);
  • CE、UL认证(部分批次)。

CGA0603X5R475K350JT出厂前经全检(容值、耐压、温度循环等),性能稳定,供货覆盖中小批量到大规模生产需求。

该产品以“稳定、高效、低成本”为核心优势,是电子设备电源与信号电路的理想选择。

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