WMSIC Electronic Components

HRE CGA0603X7R103K500JT

ModelCGA0603X7R103K500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603X7R103K500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603X7R103K500JT
Electronic Component
1
Electronic Component
10nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495351
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603X7R103K500JT 贴片陶瓷电容产品概述

一、产品型号与基本参数解析

CGA0603X7R103K500JT是HRE芯声品牌推出的多层片式陶瓷电容(MLCC),型号各部分对应明确的技术参数:

  • CGA:品牌封装系列标识(适配0603小尺寸封装);
  • 0603:英制封装尺寸(1.6mm×0.8mm,公制1608);
  • X7R:温度系数代码(-55℃~+125℃内,容值变化≤±15%);
  • 103:容值编码(10×10³pF=10nF);
  • K:精度等级(±10%);
  • 500:额定直流电压(50V);
  • JT:工艺尾缀(标识高可靠性叠层工艺)。

核心基本参数如下:

参数项 规格值 标称容值 10nF(103) 容值精度 ±10%(K级) 额定工作电压 50V DC 温度系数 X7R 封装尺寸 0603(1608) 品牌 HRE芯声

二、核心技术特性与优势

该产品基于MLCC成熟叠层工艺设计,具备以下关键特性:

  1. 宽温稳定性能:X7R温度系数覆盖-55℃~+125℃,容值随温度波动小(≤±15%),适配环境温度变化较大的场景(如车载、户外设备);
  2. 高可靠性设计:多层陶瓷叠层结构+镍电极材料,抗振动(符合IEC 60068-2-6标准,20~2000Hz/1.5g无失效)、耐冲击,寿命可达10万小时以上;
  3. 小型化适配:0603封装体积紧凑(1.6×0.8×0.8mm典型),适配智能手机、智能穿戴等高密度布局设备;
  4. 电性能优异:低等效串联电阻(ESR≤10mΩ@1kHz)、低等效串联电感(ESL≤0.5nH),高频滤波/耦合效果好,适合射频、电源电路;
  5. 无极性设计:无需区分正负极,焊接方便,降低生产出错率。

三、典型应用场景

因尺寸小、性能稳定,该产品广泛应用于以下领域:

  1. 消费电子:智能手机/平板电脑的电源滤波、音频信号耦合,智能手表的传感器供电滤波;
  2. 通信设备:无线路由器、交换机的射频匹配电路、电源去耦,蓝牙模块的信号滤波;
  3. 工业控制:PLC模块的辅助电源滤波,小型传感器的信号调理电路;
  4. 小型家电:智能音箱、蓝牙耳机的电源管理单元(PMU)滤波,电动牙刷的控制电路;
  5. 通用汽车电子:车载中控的背光驱动滤波,行车记录仪的电源稳压电路(需确认实际场景是否符合汽车级要求,通用级场景适用)。

四、封装与可靠性验证

4.1 封装规格

0603封装符合IPC-A-610标准,尺寸参数(典型值):

  • 长度:1.6±0.15mm
  • 宽度:0.8±0.15mm
  • 厚度:0.8±0.1mm
  • 电极端宽度:0.3±0.1mm

4.2 可靠性测试验证

HRE芯声对该产品完成多项可靠性测试,关键结果:

  • 高温存储:125℃/1000小时,容值变化≤±5%;
  • 温度循环:-55℃~+125℃(1000次循环),无开路/短路;
  • 耐湿负载:85℃/85%RH/50V/1000小时,容值变化≤±10%;
  • 焊接可靠性:回流焊后无裂纹,电极附着强度≥10N。

五、使用与选型注意事项

  1. 电压降额:实际工作电压建议不超过额定电压的80%(即≤40V),避免过压导致容值漂移或失效;
  2. 温度限制:禁止在超过-55℃~+125℃的环境下长期工作,极端温度可能超出X7R容值变化范围;
  3. 焊接工艺:推荐回流焊(温度曲线符合IPC J-STD-020),手工焊温度≤350℃,焊接时间≤3秒,避免损伤陶瓷层;
  4. 存储条件:常温干燥环境(25±5℃、湿度≤60%)存储,开封后1个月内使用,避免受潮影响焊接可靠性;
  5. 选型匹配:若需更高精度(±5%)或更高电压(100V),需切换对应型号(如X5R/X7S或高电压系列)。

总结

CGA0603X7R103K500JT作为HRE芯声的通用型MLCC,兼具小型化、宽温稳定、高可靠性等优势,适配消费电子、通信、工业等多领域的滤波、耦合、去耦需求,是中小功率电子设备的性价比选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.