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HRE CGA0603X5R475K160JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X5R475K160JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X5R475K160JT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264596029
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X5R475K160JT 贴片多层陶瓷电容（MLCC）产品概述
一、产品型号与基本参数
该型号为HRE芯声旗下经典MLCC产品，型号各部分对应含义如下：
- CGA：HRE芯声MLCC系列标识；
- 0603：封装尺寸（英制0603=公制1608，长1.6mm×宽0.8mm）；
- X5R：温度特性代码（-55℃~+85℃，容值变化≤±15%）；
- 475：容值编码（47×10⁵ pF=4.7μF）；
- K：精度代码（±10%）；
- 160：额定电压编码（16×10⁰ V=16V DC）；
- JT：编带包装后缀（10000pcs/盘）。
核心参数表：
参数类别 具体参数 产品类型 贴片多层陶瓷电容（MLCC） 封装尺寸 0603（英制）/1608（公制） 容值 4.7μF 精度 ±10%（K级） 额定电压 16V DC 温度范围 -55℃~+85℃ 容值温漂 ≤±15%（X5R特性） 环保标准 RoHS 2.0、无卤 包装方式 编带（10000pcs/盘）二、核心特性与优势
- 温度稳定性突出：X5R介质材料避免了Y5V等低稳定度介质的容值大幅漂移，在-55℃至+85℃范围内，容值变化控制在±15%以内，适配温度波动较大的应用场景；
- 高可靠性验证：经HRE芯声内部及第三方机构测试，通过125℃高温存储1000小时、-55℃+85℃循环1000次、振动（102000Hz/1.5g）等可靠性试验，符合IEC 60384-14标准；
- 小型化适配高密度设计：0603封装体积仅1.6mm×0.8mm×0.8mm，兼容自动化SMT贴装，可满足智能手机、智能手表等便携设备的高密度PCB布局需求；
- 低寄生参数优化电路：MLCC固有低ESR（等效串联电阻）、低ESL（等效串联电感）特性，在电源滤波、信号耦合中可有效抑制高频噪声，提升电路信噪比；
- 环保合规全球通用：无铅焊端、无镉/汞等有害物质，符合欧盟RoHS 2.0及日本JIS环保标准，可进入全球电子市场。
三、典型应用场景
该产品平衡了性能与成本，广泛应用于以下领域：
- 消费电子终端：智能手机/平板的DC-DC转换器输出滤波、音频信号耦合、CPU周边去耦；智能手表/蓝牙耳机的电源模块滤波；
- 通信设备：路由器/交换机的射频电路滤波、基站RRU的电源去耦、信号链路耦合电容；
- 工业控制：小型PLC、传感器模块、电机驱动电路的电源滤波与信号耦合（适配-20℃~+60℃工业环境）；
- 小型家电：智能电饭煲、扫地机器人的控制电路滤波（工作电压≤12V）。
四、应用注意事项
- 电压降额要求：实际工作电压建议不超过额定电压的80%（≤12.8V），避免长期过压导致容值衰减；
- 温度限制：禁止在超过+85℃的环境中持续工作，否则容值漂移会超出规格；
- 贴装工艺：回流焊峰值温度控制在230~245℃，时间≤30秒，避免热应力导致陶瓷开裂；
- 机械应力：PCB板弯曲度≤0.5%，避免MLCC因应力导致电极断裂。
五、总结
CGA0603X5R475K160JT是一款高性价比MLCC，兼具小型化、稳定温度特性与可靠性能，可满足消费电子、通信、工业等领域中低电压、一般精度要求的电路需求，是电子设计中滤波、耦合、去耦的常用选型之一。
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