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HRE CSA0603C0G180J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603C0G180J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603C0G180J500JT
- Electronic Component
- 1
- Electronic Component
- 18pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495038
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HRE CSA0603C0G180J500JT 产品概述
一、产品简介
HRE（芯声）CSA0603C0G180J500JT 是一款表面贴装多层陶瓷电容（MLCC），标称容量为 18 pF，容差 ±5%，额定电压 50 V，温度特性为 C0G（亦称 NP0）。器件采用 0603（1608 公制）封装，专为对温度稳定性、低损耗和高频特性有较高要求的电路设计而开发。
二、主要规格参数
- 容值：18 pF
- 精度：±5%（J）
- 额定直流电压：50 V
- 温度系数：C0G（0 ±30 ppm/°C，温度稳定性优良）
- 封装：0603（约 1.6 mm × 0.8 mm）表面贴装
- 品牌：HRE（芯声）
- 型号：CSA0603C0G180J500JT
三、性能特点
- 温度稳定性高：C0G/NP0 介质几乎无温度依赖，适合精密计时、振荡与滤波电路。
- 低损耗、Q 值高：在高频信号下具有优良的自谐与低等效串联电阻（ESR）特性。
- 高绝缘阻抗与低漏电：适合直流偏置敏感的应用。
- 机械可靠：适用于回流焊工艺，抗热冲击和湿度试验通过率高。
- SMT 兼容：0603 小尺寸便于高密度贴装与自动化生产。
四、典型应用
- 高频振荡器与时钟电路（晶体振荡器负载电容）
- 射频前端和匹配网络
- 精密模拟电路与滤波器（ ADC、放大器 前端）
- 汽车电子与通讯设备中对温度稳定性和可靠性有较高要求的场合
五、封装与包装
- 常见为卷带式（Tape & Reel）包装，适配自动贴片机。
- 0603 小尺寸利于 PCB 高密度布板，焊接推荐采用符合 J-STD-020 的回流焊温度曲线。
六、使用与存储注意事项
- 避免在 PCB 弯曲或机械拉扯时对器件施加应力，贴装时注意焊盘设计与焊膏量。
- 回流焊时控制温度与时间，避免超温或过度回流导致性能退化。
- 建议工作温度范围通常为 -55°C 至 +125°C；存储环境应干燥避光、防潮。
- 对电气参数有严格要求的设计，请在实际工作条件下（偏压、频率、温度）进行验证。
备注：如需更详细的电气特性曲线、尺寸图或可靠性认证信息，可联系 HRE（芯声）或参考产品数据表。
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