WMSIC Electronic Components

HRE CSA0603C0G150J500JT

ModelCSA0603C0G150J500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CSA0603C0G150J500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CSA0603C0G150J500JT
Electronic Component
1
Electronic Component
15pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495037
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSA0603C0G150J500JT — HRE(芯声) 15pF ±5% 50V C0G 0603 贴片电容产品概述

一、产品简介

CSA0603C0G150J500JT 为 HRE(芯声) 系列多层陶瓷电容(MLCC),封装规格为 0603(1608 米制),标称电容 15pF,公差 ±5%(J),额定电压 50V,介质为 C0G(亦称 NP0)。该器件以温度稳定性高、损耗小、频率特性优良著称,适用于精密射频、振荡与定时电路等对电容稳定性与低噪声有严格要求的场景。

二、主要电气与温度特性

  • 电容:15pF ±5%
  • 额定电压:50V DC
  • 温度系数:C0G(接近 0ppm/°C,温度漂移极小)
  • 介质损耗:极低,适合高 Q 值应用
  • 自谐频率高,寄生电感和寄生电阻小,适合高频使用

三、优势与适用场景

  • 温度与时间稳定性优:C0G 介质保证在宽温度范围内电容值几乎不变,适合振荡器、电压基准、滤波与定时回路。
  • 高频性能好:低损耗、低寄生适配 RF 匹配、滤波、谐振电路以及高速通信接口。
  • 小型化与自动贴装:0603 尺寸兼容主流贴片工艺,便于表面贴装生产线高速贴装与回流焊接。

四、封装与可靠性、使用注意

  • 封装:0603(1608),卷带供货,适用自动化贴装。
  • 回流焊工艺:建议遵循 JEDEC/IPC 回流曲线,避免费用超过器件耐热极限(一般峰值温度 ≤ 260°C,具体参考厂商工艺说明)。
  • 贮存与防潮:未焊接前建议密封干燥保存,开盘后在规定的 floor life 内完成贴装;避免机械应力(弯曲或强力冲击),以免产生裂纹导致性能退化。
  • 可靠性:C0G 陶瓷体系无极化效应,长期稳定,适合高可靠性电子设备。

五、典型应用举例

  • 射频匹配网络、LC 谐振回路、天线调谐件
  • 晶体振荡器负载电容、时钟与定时电路
  • 高精度 ADC 的采样网络或前端滤波
  • 高频去耦与旁路(在小电容值需求的场景)

六、订购信息与技术支持

型号:CSA0603C0G150J500JT;品牌:HRE(芯声)。订购时请确认电容值、公差、额定电压及封装。批量采购或对特殊可靠性(如汽车级、航天级)有额外要求时,建议与供应商确认详细规格书、失效分析报告及回流焊推荐曲线,以确保在目标应用中的长期稳定性与一致性。

如需规格书(Datasheet)、S-参数或样品测试数据,我可以继续为您整理或协助对比同类元器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.