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HRE CGA0402X5R475K100GT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0402X5R475K100GT
- Type
- HRE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0402X5R475K100GT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0264778612
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0402X5R475K100GT 贴片多层陶瓷电容（MLCC）产品概述
一、产品基本信息
CGA0402X5R475K100GT是HRE芯声电子推出的通用型贴片多层陶瓷电容（MLCC），针对低电压、中等容值稳定需求设计，采用标准0402封装，适配消费电子、小型工业设备等高密度布局场景。
二、核心性能参数解析
1. 容值与精度
标称容值为4.7μF（代码“475”，即47×10⁵ pF），精度等级**±10%**（代码“K”），平衡成本与实用性，满足大多数非超高精密电路需求。
2. 额定电压
额定工作电压10V DC，建议实际使用时按20%降额（≤8V），避免电压应力导致介质击穿，提升长期可靠性。
3. 温度特性
采用X5R陶瓷介质，温度适用范围**-55℃至+85℃**，容值变化率≤±15%（典型值），相比Y5V等介质更稳定，适合环境温度波动场景。
4. 损耗特性
损耗角正切（tanδ）典型值≤0.02（1kHz/25℃），低损耗适配信号耦合、电源去耦等低能量损耗电路。
三、封装与物理特性
- 尺寸：0402封装（英制0.04″×0.02″，公制1.0mm×0.5mm），厚度约0.55mm（典型值），支持高密度PCB布局。
- 电极设计：外部电极采用镍/锡镀层（Ni/Sn），兼容回流焊（260℃峰值）、波峰焊，焊接可靠性高。
- 环保合规：符合RoHS 2.0、REACH标准，无铅无卤，满足绿色制造要求。
四、典型应用场景
- 消费电子：智能手机、智能手环的CPU供电滤波、音频信号耦合；
- 便携式设备：蓝牙耳机、移动电源的电池电路去耦、LED驱动滤波；
- 小型工业：传感器模块、PLC辅助电路的干扰抑制、稳压旁路；
- 通信模块：WiFi/蓝牙射频信号去耦、基带电路旁路。
五、品牌与可靠性说明
HRE芯声为国内MLCC专业制造商，产品通过ISO9001认证，该型号经多项可靠性测试：
- 高温寿命：1000小时@85℃/10V，容值变化≤10%；
- 温度循环：-55℃→+85℃循环500次，容值变化≤12%；
- 湿度加载：85℃/85%RH 500小时，容值变化≤8%；
符合JIS C 5102、IEC 60384-1行业标准。
六、选型与替换参考
替换需满足：封装0402、电压≥10V、容值4.7μF±10%、温度特性X5R及以上，典型替换型号：
- 村田：GRM155R61C475KA88D；
- 三星：CL05B475K0G100NB；
- 国巨：CC0402KRX5RBB475。
该型号以高性价比、稳定性能成为小型电子设备的常用选择，适配主流生产工艺与应用场景。
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