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HRE CGA0603X7R105K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R105K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R105K500JT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264778565
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R105K500JT 产品概述 — HRE(芯声) 0603 1µF ±10% 50V X7R 贴片电容
一、产品简介
CGA0603X7R105K500JT 是 HRE(芯声) 出品的一款多层陶瓷贴片电容（MLCC），规格为 0603（1608公制），标称电容 1µF，容差 ±10%，额定电压 50V，介质材料为 X7R。该系列针对中高压去耦、滤波与储能需求设计，兼顾体积小、可靠性高与便于高速贴装的特性，适用于消费电子、电源模块及工业控制等领域。
二、主要参数
- 型号：CGA0603X7R105K500JT
- 容值：1µF
- 容差：±10%（K）
- 额定电压：50V
- 介质：X7R（温度系数，常温至高温下电容变化受控）
- 封装：0603（英制）/1608（公制）
- 适用工艺：SMT 回流焊（无铅工艺兼容）
三、产品特性
- 小尺寸、高容值：0603 封装在有限的 PCB 面积内提供较高电容，适合紧凑布局。
- X7R 介质：在 -55°C 至 +125°C 范围内保持良好电容稳定性，适合一般温度变化环境。
- 低等效串联电阻（ESR）与低等效串联电感（ESL），利于高频去耦与快速瞬态响应。
- 可贴装性强：适用于高速贴片机与自动化生产线，符合常见回流焊曲线要求。
- 环保合规：符合 RoHS 要求，满足现代电子产品环保规范（具体认证以供货证明为准）。
四、典型应用
- 电源去耦与旁路（DC-DC 转换器输入/输出）
- 高频滤波与耦合回路
- 模拟电路旁路、稳定放大器工作点
- 单片机、射频模块及通信设备的电源稳压与瞬态响应优化
五、使用建议与注意事项
- 直流偏置效应：高介质常见电压依赖性，实际工作电压接近额定值时有效电容会下降，设计时建议适当裕量或选用更高额定电压型号。
- 布局建议：靠近电源引脚放置、缩短走线与过孔、并联多颗以改善 ESR/ESL。
- 回流焊工艺：遵循厂商回流焊温度曲线，避免超温或过长浸渍时间以保证可靠性。
- 环境与可靠性：避免长期高温高湿、机械应力集中处（如 PCB 弯曲区域）以防开裂或性能退化。
六、包装与订购信息
- 包装：常见为卷带（Tape & Reel），适配自动贴片机；具体盘数与卷轴尺寸请参考订购数据表。
- 订购型号示例：CGA0603X7R105K500JT（如需大宗或指定封装/测试报告，请与 HRE(芯声) 或授权分销商联系以获取最新供应与质量文件）。
如需完整的电气参数曲线（温度特性、频率响应、直流偏置曲线）或回流焊工艺曲线，可提供数据表进一步参考。
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