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HRE CGA0603C0G270J500JT
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603C0G270J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603C0G270J500JT
- Electronic Component
- 1
- Electronic Component
- 27pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264743646
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603C0G270J500JT 产品概述
一、产品简介
CGA0603C0G270J500JT（品牌：HRE / 芯声）为0603（1608公制）贴片多层陶瓷电容，标称容量27pF，容差±5%（J），额定直流电压50V，介质材料为C0G（又称NP0）。该系列以优异的温度稳定性和低介质损耗著称，适用于对频率稳定性和精度要求较高的电路。
二、主要电气性能
- 容值：27pF
- 精度：±5%（J）
- 额定电压：50V DC
- 温度系数/材质：C0G（典型温度系数接近0ppm/°C，常见限值约±30ppm/°C）
- 封装：0603（1.6 × 0.8 mm）
- 介质特性：极低漏损、低电容漂移、良好自谐频率特性，适合高频及高精度场合。
三、特点与优势
- 温度稳定性高：C0G材质在宽温区间内容量变化极小，适合温度敏感电路。
- 低损耗：介质损耗小，有利于高Q值滤波和射频前端应用。
- 尺寸小、可靠性高：0603封装兼顾体积与焊接可靠性，适合贴片自动化生产。
- RoHS/无铅回流兼容：满足现代电子制造环保与工艺要求（具体认证以出厂数据表为准）。
四、典型应用场景
- 高频滤波、耦合与匹配网络（RF 前端）
- 精密振荡器与定时电路（晶振负载、谐振回路）
- 模拟前端与采集系统（增益与滤波网络）
- 仪表与测量设备中需稳定容量的参考或补偿电路
五、封装与组装建议
- 封装尺寸：0603（1608M）便于自动贴装。
- 焊接方式：推荐无铅回流焊工艺，遵循曲线温度门限以避免过热。
- PCB 布局：电容靠近被旁路或耦合的元件与地线，焊盘设计与制造商建议一致以降低应力与提高焊接可靠性。避免板弯曲或在焊接后立即施加机械应力。
六、可靠性与存储建议
- 储存环境：建议干燥低温环境，避免高湿与直射阳光，长期存放应密封防潮包装。
- 使用环境：推荐在制造商给定温度与电压范围内工作，避免长期超过额定电压或高温导致性能退化。
- 可靠性测试：常见通过焊接耐温、湿热与机械应力测试以验证实际应用可靠性，具体参数以出厂规格书为准。
七、采购与替代型号
型号 CGA0603C0G270J500JT 为标准化命名，便于在BOM中直接使用。采购时请确认批次与规格书一致。若需替代，可选择相同性能（27pF、±5%、50V、C0G、0603）且质量可追溯的同类产品，注意比较介质损耗、温度系数与封装公差等关键参数以保证电路性能。
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