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HRE CGA0603X7R104K101JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R104K101JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R104K101JT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495106
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R104K101JT 产品概述
一、产品简介
CGA0603X7R104K101JT 为贴片多层陶瓷电容（MLCC），额定容量 100nF（104）、容差 ±10%、额定电压 100V、温度特性 X7R，封装 0603（1.6mm × 0.8mm）。该器件适用于空间受限但要求较高电压等级和通用旁路/去耦的电路场合，兼顾体积与电压耐受能力。
二、主要规格参数
- 容值：100nF（0.1μF）
- 容差：±10%（K）
- 额定电压：100V DC
- 温度特性：X7R（±15% 在 −55℃ 至 +125℃）
- 封装：0603（公制约 1.6 × 0.8 mm）
- 结构：多层陶瓷芯片，表面贴装
三、材料与电气特性
X7R 为类 II 陶瓷介质，具备中等介电常数与较高体积效率，但温度和直流偏置下容量有可测的变化。与同规格 C0G/NP0 相比，X7R 提供更高容值/体积比，但温度漂移、老化和直流偏置影响更明显。MLCC 本身具有低等效串联电阻（ESR）与低等效串联电感（ESL），适合高频去耦和滤波。
四、设计与使用建议
- DC 偏置影响：在接近额定电压时，X7R 小尺寸陶瓷电容的有效容量会明显下降（具体幅度与片厚和介电层相关），重要电路应在实际工作电压下评估并留有裕度。
- 退化与老化：X7R 存在随时间的容量老化，首次使用后容量短期内会有下降，需在设计中考虑。
- 额定余量：对关键去耦/储能场合建议采用降额策略或并联多颗以保证稳定性和容值余量。通常在高可靠性场合建议留出一定的电压和温度裕度。
五、封装与工艺
0603 尺寸小，适合高密度贴装。推荐按通用回流焊工艺（参考 J-STD-020）进行焊接，峰值温度不超过 260℃，避免过度预热或长时间高温。贴装时注意避免基板挠曲与过度压力，防止焊后裂纹导致失效。清洗与助焊剂使用应参考厂家工艺建议。
六、可靠性与测试
常见可靠性验证包括耐压测试、热冲击、温湿度循环、机械冲击/振动以及焊接耐受性测试。具体等级与寿命参数应参照供应商出具的数据表与认可的质量标准。批量选型时建议索取 DC 偏置曲线、老化特性及焊接可靠性报告。
七、典型应用
- 电源去耦与旁路（中高压轨）
- 开关电源输入/输出滤波
- 模拟电路旁路、耦合与稳定回路
- 工业、通信、仪表等对体积与电压有要求的场合
八、选型注意与等效替代
选型时务必关注在工作电压和温度条件下的实际有效容量（查看 DC bias 曲线），若对温漂和稳定性有更高要求可考虑 C0G/NP0 或增大尺寸/并联多颗。市场上有多家厂商提供相同规格的 100nF 100V X7R 0603 产品，选型可比对 DC bias、寿命与可靠性测试数据。
如需器件数据手册、DC 偏置曲线或推荐焊接工艺参数，可联系供应商或索取 HRE（芯声）的详细资料以确保在具体应用中的可靠性与性能。
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