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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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CGA1206X7R104K101MT是芯声电子(HRE)推出的中高压宽温型多层陶瓷电容(MLCC),属于工业级通用系列产品。该型号采用1206表面贴装封装,核心参数适配电源滤波、工业控制等中高压电路场景,兼具体积紧凑、容值稳定、可靠性高的特点,是电子设备中基础无源器件的优选之一。
容值为100nF(标注“104”,即10×10⁴ pF),精度±10%。该精度满足大多数电路对电容偏差的要求,无需额外匹配调试,可直接用于滤波、耦合等常规功能,适配批量生产场景。
额定直流电压为100V,是该型号的核心电压指标。适用于中高压电路(如输出50-80V的电源模块),需注意:交流电路中需按频率降额(如1kHz交流电压建议≤50V),避免介质击穿。
X7R为陶瓷电容常见温度系数类别,定义为:-55℃~+125℃范围内,容值变化≤±15%。相比Y5V等系数更稳定,适合环境温度波动较大的场景(如户外工业设备、车载辅助电路)。
采用多层陶瓷介质叠层工艺,通过印刷、烧结制成,相比单层电容体积缩小数倍,实现“小体积大容量”,适配高密度PCB设计需求。
型号中“1206”为英制表面贴装封装,对应公制尺寸3216(长3.2mm±0.2mm,宽1.6mm±0.2mm),厚度通常0.5mm±0.1mm(具体以HRE官方 datasheet 为准)。无引脚设计,直接贴装PCB表面,节省布线空间。
引脚端采用镍钯金(Ni/Pd/Au)复合镀层,兼具良好焊接性(回流焊兼容性好)和抗腐蚀性,避免长期使用中引脚氧化导致接触不良。
该型号参数适配以下场景:
芯声电子(HRE)是国内MLCC领域的专业厂商,该型号符合:
该型号是中高压电路中平衡“容量、体积、稳定性”的实用选择,可覆盖多数工业及消费电子场景的基础电容需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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