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HRE CSA0603X7R221K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603X7R221K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603X7R221K500JT
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495046
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0603X7R221K500JT 产品概述
一、产品简介
CSA0603X7R221K500JT 为 HRE(芯声) 系列贴片多层陶瓷电容（MLCC），标称电容值 220pF，公差 ±10%，额定电压 50V，温度特性 X7R，0603（1608公制）封装。该型号适用于对体积、可靠性与成本有平衡要求的消费电子与工业控制应用。
二、主要技术参数
- 电容值：220pF
- 公差：±10%（K）
- 额定电压：50V DC
- 温度系数：X7R（-55°C ~ +125°C，±15%）
- 封装：0603（1.6×0.8 mm）
- 材料：多层陶瓷（介电常数稳定的X7R材料）
- 引脚/端面：无极性，适用于回流焊工艺
三、特性与优势
- 小尺寸（0603）满足高密度贴片需求，有助于缩小产品体积。
- X7R 温漂适合滤波、去耦和耦合等一般用途，温度范围宽且性能稳定。
- 50V 额定电压提供较宽的工作余量，适用于低压至中等电压电源线路。
- 批量一致性好，适合自动化贴片与高可靠性量产。
- 无极性设计，安装方向灵活，便于布局优化。
四、典型应用场景
- 电源去耦（DC-DC 模块、稳压器输入输出）
- 高频滤波与信号耦合（射频前端、滤波网络）
- 时钟与定时电路中作为旁路或补偿元件
- 便携设备、通讯设备、工业控制、汽车电子（非关键安全回路）
五、封装与焊接建议
- 推荐使用标准回流焊工艺，遵循焊膏量与温度曲线控制以避免热冲击或焊接拉裂。
- 在 PCB 布局时，去耦电容尽量靠近电源引脚与地平面布置，焊盘尺寸与焊膏量配合 0603 封装。
- 对于需频繁波动电流的应用，建议并联适当容量或采用更低 ESR 的组合结构以提升性能。
六、可靠性与储存
- 常温下保存，避免潮湿与污染；如长期库存建议防潮包装（干燥剂防潮袋）。
- 典型可靠性试验包括温度循环、湿热、机械抗震等，应用时应参考客户验收规范与行业标准。
七、采购与替代建议
- 型号后缀 CSA 表示系列，订购时确认完整料号与包装卷盘规格。
- 若需更高稳定性或低温漂，可考虑 C0G（NP0）材料；若要求更大电容量可选更大封装（0402/0805以外）。
- 如需样品或大量采购，可与 HRE(芯声) 授权分销商联系，确认交期与质量认证文件（RoHS、REACH 等）。
如需具体阻抗曲线、ESR/ESL 数据或推荐的 PCB 焊盘尺寸、回流曲线，我可以根据您的应用场景提供更详细的工程建议。
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