WMSIC Electronic Components

HRE CGA0603C0G102J500JT

ModelCGA0603C0G102J500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603C0G102J500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603C0G102J500JT
Electronic Component
1
Electronic Component
1nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265356352
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HRE CGA0603C0G102J500JT 多层陶瓷电容器产品概述

一、产品基本参数与型号拆解

核心参数表

参数项 规格说明 品牌 HRE(芯声) 产品型号 CGA0603C0G102J500JT 封装类型 0603(英制:0.06×0.03英寸;公制:1.6×0.8mm) 容值 1nF(编码102:10×10²pF) 容值精度 ±5%(J档) 额定电压 50V(直流) 温度系数 C0G(EIA代码,对应IEC NPO) 工作温度范围 -55℃ ~ +125℃(典型值) 环保标准 RoHS 2.0、REACH

型号拆解说明

  • CGA:HRE品牌多层陶瓷电容器(MLCC)系列标识;
  • 0603:封装尺寸(适配小型化PCB布局);
  • C0G:低损耗高稳定陶瓷介质(温度系数<±30ppm/℃);
  • 102:容值编码(有效数字+幂次,10×10²pF=1nF);
  • J:容值精度等级(±5%);
  • 500:额定电压标识(50V);
  • JT:包装/编带标识(1000pcs/盘,SMD编带封装)。

二、核心性能与优势

  1. 温度稳定性优异
    C0G介质容值随温度变化可忽略(<±0.3%),适合对频率、信号精度要求高的场景(如振荡电路)。

  2. 低损耗高频特性
    高频频段(10MHz~1GHz)下介质损耗角正切值(tanδ)<0.001,减少信号能量损耗,提升射频电路效率。

  3. 小型化高密度适配
    0603封装体积仅1.6×0.8mm,可降低PCB布局空间,适配手机、穿戴设备等小型化产品。

  4. 可靠性与宽电压
    50V额定电压满足中低压电路需求,通过125℃/2000h高温寿命测试、-55℃~125℃/1000次温度循环测试,一致性达行业标准。

  5. 环保合规
    符合RoHS 2.0无铅要求,不含镉、汞等有害物质,适配全球市场准入。

三、典型应用领域

该产品因性能均衡,广泛覆盖以下场景:

  1. 射频/微波电路:手机、路由器、蓝牙设备的射频前端滤波、耦合电容;
  2. 电源滤波:DC-DC转换器、线性电源的输出纹波抑制;
  3. 振荡与谐振电路:晶体振荡器、LC谐振电路的补偿电容;
  4. 消费电子终端:智能手机、智能手表的信号耦合、去耦电容;
  5. 工业控制:PLC、传感器模块的滤波与信号耦合(满足工业级温度要求)。

四、选型与使用注意事项

  1. 电压降额:长期工作电压建议不超过40V(降额20%),避免过压损坏;
  2. 温度适配:确认环境温度在-55℃~125℃内,超温需更换X7R等温度系数产品;
  3. PCB焊盘匹配:0603封装焊盘建议尺寸(IPC-7351标准):长1.01.2mm,宽0.60.8mm;
  4. 精度需求:±5%精度适合通用场景,高精度需求(如±1%)需选F档产品;
  5. 焊接工艺:无铅回流焊峰值温度控制在245℃±5℃,回流时间<30s,避免陶瓷开裂。

五、HRE品牌保障

HRE(芯声)是国内专注MLCC研发的高新技术企业,拥有自主陶瓷材料配方与叠层工艺,产品覆盖通用型、高频型、高容值全系列。CGA0603C0G系列通过AEC-Q200(部分型号)、IEC 60384-1等国际认证,供应稳定,可满足批量生产需求。

该产品以高稳定性、低损耗、小型化为核心优势,是通用电子电路中高频滤波、耦合的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.