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HRE CSA0805X7R103K500KT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- HRE CSA0805X7R103K500KT
- Type
- HRE
- Minimum package
- 4000
Technical parameters
- Electronic Component
- HRE
- Electronic Component
- CSA0805X7R103K500KT
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264495024
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0805X7R103K500KT 产品概述
一、产品简介
CSA0805X7R103K500KT 为 HRE（芯声）品牌的一款贴片多层陶瓷电容（MLCC），标称容值 10nF，精度 ±10%（K），额定电压 50V DC，介质材料 X7R，封装规格 0805（公制 2012，约 2.0 × 1.25 mm）。该系列针对一般电子去耦、旁路和滤波用途进行了优化，兼顾体积与容量比。
二、主要电气性能
- 容值：10 nF（标称，25°C、无偏压条件）
- 精度：±10%（K）
- 额定电压：50 V DC
- 温度特性：X7R（-55°C 至 +125°C 范围内容值变化不超过 ±15%）
- 介质特性：损耗小、等效串联电阻（ESR）低，适合高频旁路与一般滤波场景，但在直流偏压下容值会有下降，实际工程使用需考虑偏压系数带来的容值衰减。
三、机械与封装信息
- 封装：0805（0805 英寸类比），常见厚度约 0.8–1.0 mm（视具体出厂型号略有差异）。
- 包装方式：卷带（Tape & Reel），常见卷盘直径 7" 或 13"，每盘数量通常为数千件（具体以出厂包装为准）。
- 引脚与焊接：表面贴装，建议按 IPC-7351 对应 0805 焊盘设计，回流焊工艺推荐遵循 JEDEC/IPC 标准曲线。
四、可靠性与合规
- 温湿循环、冲击与振动性能适用于消费及工业电子常规应用。
- 符合 RoHS 环保要求（具体合规证书请参考厂家出具的文件）。
- 若用于汽车或关键任务系统，请向供应商确认是否通过 AEC-Q200 或其它特殊可靠性认证。
五、应用场景
- 电源去耦与旁路（DC-DC、LDO 输出）
- 高频滤波（输入/输出 EMI 抑制）
- 信号耦合与定时电路
- 消费电子、通信设备、工业控制等一般电子产品
六、使用建议与注意事项
- 偏压效应：X7R 在施加 DC 偏压时会产生容值下降，0805 尺寸在 50V 偏压下降幅可达数十％，设计时应留出裕量或做实际测试验证。
- 回流焊：推荐遵循 J-STD-020 湿敏等级和回流曲线，峰值温度一般不超过 260°C；防止过热与快速机械冲击。
- 机械应力：贴片电容对 PCB 弯曲敏感，焊接与装配过程中应避免过度应力，防止裂纹和失效。
- 备货与选型：型号中各字段含义通常为：CSA（系列）/0805（封装）/X7R（介质）/103（容值 10nF）/K（±10%）/500（50V）/KT（包装或终端工艺标识），以实际数据手册为准。
如需完整电气参数曲线（温度特性、频率响应、偏压特性、机械尺寸图）及可靠性测试报告，请告知，我可提供对应的数据手册或协助获取样片验证方案。
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