WMSIC Electronic Components

HRE CGA0805X5R226M160MT

ModelCGA0805X5R226M160MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X5R226M160MT
Type
HRE
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X5R226M160MT
Electronic Component
1
Electronic Component
22uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0264495144
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X5R226M160MT 产品概述

一、产品简介

CGA0805X5R226M160MT 为 HRE(芯声) 推出的贴片多层陶瓷电容(MLCC),标称容值 22μF,公差 ±20%,额定电压 16V,介质材料为 X5R,封装规格为 0805(公制 2012)。该产品以体积小、容值相对较大为特点,适用于对体积和性能有平衡要求的消费电子、电源与信号去耦场合。

二、主要性能参数

  • 容量:22 μF(标称)
  • 公差:±20%
  • 额定电压:16 V DC
  • 介质类型:X5R(温度特性适用于 -55°C 至 +85°C)
  • 封装:0805(2012)SMD
    这些参数决定了器件在常温与中等温度范围内具有良好的去耦与旁路能力,但需注意 X5R 在温度与直流偏压下存在一定的电容漂移。

三、结构与封装

0805 封装采用多层陶瓷堆叠结构,两端电极为银或镀镍银等可焊金属,表面有抗氧化涂层,适配常见回流焊工艺。常见出货方式为卷盘(Tape & Reel),便于自动贴片与批量生产。

四、典型应用场景

  • DC-DC 开关电源输出滤波与储能
  • MCU、FPGA、ASIC 电源去耦与局部旁路
  • 手机与便携设备次级电源滤波
  • 通信设备与家电等对体积/成本敏感的场合

五、设计与使用注意事项

  • DC 偏压与温度影响:高容值的 X5R MLCC 在加入直流电压时会出现容量降低,设计时应依据实际工作电压查阅厂方直流偏压曲线并留余量。
  • 走线与布局:尽量将电容靠近功率引脚或参考地,焊盘短且对称,以降低串联电感与等效阻抗。
  • 串并联策略:若需更稳定的电容与更低的 ESR,可与低容值、低ESL 的电容并联使用。
  • 回流焊工艺:遵循厂商推荐的回流温度曲线,避免冷热冲击和过长高温暴露以减少裂纹风险。

六、储存与可靠性建议

  • 防潮包装:长期存储请保持原封装,烘烤要求依厂方说明执行以避免吸湿后回流焊产生裂纹。
  • 检验与测试:批量使用前建议抽样做外观、电容量和耐压测试;在关键应用中评估温度循环与机械冲击后的可靠性。

总结:CGA0805X5R226M160MT 在 0805 小封装下提供较大电容量,适合多种去耦和滤波应用,但设计时应充分考虑 X5R 的温度与直流偏压特性,并采用合理的 PCB 布局与回流焊工艺以保证长期可靠性。若需更详尽的电气特性曲线与可靠性数据,请参照 HRE(芯声) 官方数据手册。

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