Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X5R226M6R3JT是HRE(芯声)品牌推出的0603封装贴片陶瓷电容(MLCC),核心参数清晰明确:
这款电容的特性适配中低压、高密度PCB设计场景,核心亮点如下:
稳定的温度特性
X5R是MLCC中常见的中温特性类型,工作温度覆盖-55℃至+85℃,容量变化控制在±15%以内——既满足一般电子设备的环境温度需求,又比Y5V等低价电容的容量稳定性高,适合对容量偏差有一定要求的电路。
中大容量适配低压场景
22μF的容值在0603封装下属于偏大规格(依赖成熟的多层陶瓷工艺实现),搭配6.3V额定电压,刚好覆盖3.3V、5V等主流低压系统的滤波、耦合需求,避免了高压电容的体积冗余。
小型化高密度设计
0603封装是消费电子领域的主流小封装之一,体积仅1.6mm×0.8mm×0.8mm左右,能有效降低PCB布局面积,适合智能手机、蓝牙耳机等小型化设备的高密度布线。
可靠性与环保
采用无铅(Pb-free)工艺制造,符合RoHS环保指令;HRE作为国内MLCC厂商,产品经过高温存储、温度循环等常规可靠性测试,满足工业级基础要求。
CGA0603X5R226M6R3JT的参数匹配多个领域的低压电路,常见应用包括:
为确保产品性能稳定,使用时需注意以下几点:
产品符合以下行业规范:
这款电容以“小体积+中容量+稳定特性”为核心优势,是低压高密度电路设计的实用选择,尤其适合消费电子、可穿戴设备等领域的批量应用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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